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CEC1712H-S2-I/SX

Microchip Technology

CEC1712H-S2-I/SX by Microchip Technology

CEC1712H-S2-I/SX by Microchip Technology is a MICROPROCESSOR CIRCUIT with 84 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, compatible with I2C, QSPI, UART buses. With a low supply voltage range of 1.71-1.89 V, it's ideal for INDUSTRIAL applications requiring high performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,893 parts In-Stock

1+ parts

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4,893

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 78 parts In-Stock

1+ parts

$7.230

100+ parts

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78

$7.230

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Microchip USA

USA . 3,692 parts In-Stock

1+ parts

$25.032

100+ parts

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3,692

$25.032

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Corohmni

South Africa . 1,072 parts In-Stock

1+ parts

$73.003

100+ parts

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1,072

$73.003

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RGB Technical Solutions

Ukraine . 6,561 parts In-Stock

1+ parts

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6,561

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Unleash the power of innovation with the CEC1712H-S2-I/SX by Microchip Technology. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, making it a must-have in the world of Other Function uPs,uCs & Peripheral ICs. From its industrial-grade temperature tolerance to its advanced technology and compatibility with I2C, QSPI, and UART buses, this product is designed to exceed expectations. Elevate your projects with the value, benefits, and advantages that only Microchip Technology can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it easy to handle and less prone to damage during handling and installation.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product onto a PCB, saving space and enabling efficient assembly in electronic devices.

Maximum Supply Voltage: 1.89 V

The higher maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a PCB and enables easy alignment during assembly.

No. of Terminals: 84

With a high number of terminals, this product offers extensive connectivity options, allowing for versatile integration into complex electronic systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch contributes to efficient signal transfer and reduced signal loss, enhancing the overall performance of the product.

Minimum Supply Voltage: 1.71 V

The lower minimum supply voltage allows for operation in energy-efficient devices and ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates efficient heat dissipation and soldering during the assembly process, improving thermal management and reliability.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a slim profile, allowing for compact designs in space-constrained electronic devices.

Width: 7 mm

The moderate width of the package provides a balance between space efficiency and ease of handling during assembly.

Length: 7 mm

The moderate length of the package offers a compact form factor, suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments typically found in industrial settings.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the processing capabilities of the product, enabling advanced functionality and performance.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The use of ball terminals ensures reliable electrical connections, easy soldering, and enhanced mechanical strength, improving the overall durability of the product.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable operating voltage for optimal performance, ensuring consistent operation in various applications.

Bus Compatibility: I2C, QSPI, UART

The compatibility with I2C, QSPI, and UART bus interfaces enables seamless integration with a wide range of devices and communication protocols, enhancing connectivity and versatility.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense packing of terminals on the package, enabling high connectivity in a compact form factor, suitable for space-constrained designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CEC1712H-S2-I/SX attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

3.3V NOM SUPPLY ALSO AVAILABLE

Bus Compatibility:

I2C, QSPI, UART

JESD-30 Code:

S-PBGA-B84

Length:

7 mm

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,10X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CEC1712H-S2-I/SX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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