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TCI6638K2KDAAWA2

Texas Instruments

TCI6638K2KDAAWA2 by Texas Instruments

TCI6638K2KDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The CMOS technology and compact size of 40x40 mm make it ideal for advanced embedded systems requiring efficient processing power.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,081 parts In-Stock

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7,081

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Digiode

USA . 3,055 parts In-Stock

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3,055

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Distributors (Availability)

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AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$7.286

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775

$7.286

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One Stop Electronics

USA . 1,527 parts In-Stock

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$20.000

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1,527

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Parana Technologies

USA . 656 parts In-Stock

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$30.710

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$69.281

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656

$30.710

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$69.281

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DigiPath Technology Company

USA . 366 parts In-Stock

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$33.816

100+ parts

$31.111

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366

$33.816

$31.111

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ChromeModa Solutions

Germany . 1,623 parts In-Stock

1+ parts

$34.506

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$28.295

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1,623

$34.506

$28.295

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IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$34.506

100+ parts

$32.781

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$31.055

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723

$34.506

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$31.055

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Corohmni

South Africa . 358 parts In-Stock

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$43.186

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Corphita

USA . 690 parts In-Stock

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Overview

Discover the cutting-edge TCI6638K2KDAAWA2 by Texas Instruments, a high-quality microprocessor circuit that promises superior performance and reliability. As a trusted manufacturer, Texas Instruments delivers top-notch products like this one, perfect for a wide range of applications. With its advanced technology and innovative design, this peripheral IC offers unparalleled value, efficiency, and versatility to customers looking for the best in the industry. Experience the benefits of this exceptional product and take your projects to new heights with the TCI6638K2KDAAWA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during manufacturing processes.

Maximum Supply Voltage: 1.05 V

Supports a wide range of supply voltages, increasing compatibility with various power sources.

Package Shape: SQUARE

Square shape allows for more compact and space-efficient design, ideal for applications where size is a concern.

No. of Terminals: 1517

High number of terminals enable versatile connectivity options, allowing for complex circuit configurations.

Package Style (Meter): GRID ARRAY

Grid array package style offers secure and stable mounting on circuit boards, reducing the risk of mechanical failures.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement increases energy efficiency and reduces power consumption.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to solder and connect the product to the circuit board, simplifying installation.

Maximum Seated Height: 3.75 mm

Low seated height allows for a slim and compact profile, suitable for applications with space constraints.

Width: 40 mm

Moderate width ensures that the product can fit comfortably on standard-sized circuit boards, facilitating integration.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time reduces the risk of overheating and damage to the product during soldering, improving overall reliability.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures that the solder joints are properly melted and bonded, leading to strong and durable connections.

Length: 40 mm

Moderate length allows for flexibility in placement on the circuit board, accommodating various layout designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of a microprocessor circuit enhances the functionality and processing power of the product, making it suitable for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, reducing the risk of intermittent electrical contacts.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and reliability under varying operating conditions.

Terminal Pitch: 1 mm

Compact terminal pitch allows for high-density mounting, enabling more components to be packed in a limited space.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product is suitable for standard solder reflow processes, ensuring quality solder joints and long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6638K2KDAAWA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6638K2KDAAWA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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