Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TMS320DM6467CZUT7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 0-85°C, it has a supply voltage range of 1.14-3.3V and peak reflow temperature of 245°C. Ideal for applications requiring high processing power in compact designs.
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$83.000
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$110.248
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DigiKey Marketplace
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This material provides durability and protection for the integrated circuits inside the package.
Allows for easy and convenient mounting on printed circuit boards, saving space and facilitating automated assembly.
Ensures safe operation within specified voltage limits, preventing damage to the IC.
Square shape is conducive to efficient use of space on a PCB and enhances thermal management.
Offers high processing capability and supports complex operations in various applications.
Provides flexibility in voltage requirements, making the IC compatible with a wide range of systems.
Having a high number of terminals allows for multiple connections and functionalities in the circuit.
Enables high-density mounting and precise alignment of the IC on the PCB, improving overall performance.
Ensures reliable operation even at lower voltage levels, enhancing the product's versatility.
Can withstand elevated temperatures, making it suitable for a variety of operating environments.
Operates effectively at lower temperatures, ensuring reliable performance in different conditions.
This finish provides good conductivity, corrosion resistance, and solderability, ensuring robust connections.
Bottom terminal position simplifies PCB layout and routing, enhancing the overall design efficiency.
Low profile design allows for compact system integration and reduces overall product size.
Ample RAM capacity supports data storage and processing requirements for various applications.
Compact width dimension facilitates space-saving design and integration into tight spaces.
Allows for efficient soldering process during manufacturing, ensuring quality assembly of the IC.
High peak reflow temperature ensures reliable soldering joints for robust PCB connections.
Balanced length dimension complements the square shape, providing an optimal form factor for integration.
Incorporating a microprocessor circuit adds computational capabilities and versatility to the IC's functions.
CMOS technology offers low power consumption, high speed, and compatibility with various applications.
Ball terminal form enhances solder joint reliability, enabling secure and durable connections.
Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage levels.
Fine terminal pitch allows for high-density mounting and precise connections on the PCB, enhancing performance.
Fixed-point format facilitates accurate arithmetic operations and precise calculations in the IC.
MSL 4 rating indicates the IC's tolerance to moisture exposure during storage and assembly processes.
Other Function uPs,uCs & Peripheral ICs TMS320DM6467CZUT7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
Additional Features:
Bit Size:
Format:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
RAM Words:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
TMS320DM6467CZUT7 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
CRCW06031K00FKEAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06031K00FKEAHP is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.33 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 75 V.
EU2B-YS2J03F
Idec
ROTARY SWITCH;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
CRCW04020000Z0EDHP
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Weitron Technology
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
CY8C6247BZI-D34
Infineon Technologies
CY8C6247BZI-D34 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. This IC is ideal for applications requiring a compact form factor and high performance in various electronic devices.
AS5140H-ASSM
Ams Ag
SYSTEM ON CHIP; Terminal Finish: TIN; JESD-609 Code: e3;
XCZU4EV-3FBVB900E
Xilinx
Xilinx XCZU4EV-3FBVB900E is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance computing in compact form factors.
EFR32MG24A010F1536IM40-B
Silicon Labs
EFR32MG24A010F1536IM40-B by Silicon Labs is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, with supply voltage ranging from 1.71V to 3.8V. Ideal for applications requiring low-profile and high-temperature performance like IoT devices and wearables.
XAZU5EV-1SFVC784Q
Xilinx XAZU5EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, FINE PITCH with 784 terminals and measures 23x23 mm in size.
MCIMX6G1CVM05AB
NXP Semiconductors
MCIMX6G1CVM05AB by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 105°C. It features a low profile grid array package style, 0.8mm terminal pitch, and industrial temperature grade. Ideal for applications requiring high performance in compact designs.
PGA460TPWR
Texas Instruments
PGA460TPWR by Texas Instruments is a 16-terminal IC with a supply voltage range of 6-28V. It operates in temperatures from -40 to 125°C, making it suitable for automotive applications. This CMOS technology-based peripheral IC supports SPI, UART, and USART bus compatibility.
ESP32-WROOM-32E(M113EH3200PH3Q0)
Espressif Systems (Shanghai)
ESP32-WROOM-32E(M113EH3200PH3Q0) by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3-3.6V. It has an industrial temperature grade of -40 to 85°C and is ideal for IoT applications requiring low power consumption and wireless connectivity.
CYAT827AZA59-3200A
PSoC;
TCI6630K2LCMS
TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.
AM5718AABCX
AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.
STSPIN32F0ATR
STSPIN32F0ATR by STMicroelectronics is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 6.7V to 45V, making it ideal for AUTOMOTIVE applications. The chip carrier package style and square shape make it suitable for surface mount assembly in various electronic systems.
XC7Z030-1FFG676C
XC7Z030-1FFG676C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.
EFR32BG24B220F1024IM48-B
EFR32BG24B220F1024IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C and supports supply voltages from 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
MFRC52201HN1,115
The NXP Semiconductors MFRC52201HN1,115 is a microprocessor circuit with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -25 to 85°C and requires a power supply of 3/3.3V. This IC is commonly used in applications requiring contactless communication and RFID technology.
ATWINC1500-MR210PB1961
Microchip Technology
Microchip Technology's ATWINC1500-MR210PB1961 is a CMOS network controller with 28 terminals. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 3.6V. Ideal for industrial applications requiring surface mount technology and a compact rectangular package style.
MCIMX283CVM4B
MCIMX283CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.
MCP2221-I/ST
MCP2221-I/ST by Microchip Technology is a 14-terminal IC with max supply voltage of 5.5V and operates b/w -40 to 85 °C. Ideal for industrial applications, it features CMOS technology, dual terminal position, and matte tin finish for microprocessor circuits.
ATWINC1510-MR210PB1961
ATWINC1510-MR210PB1961 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in a compact rectangular package style.
XCZU2CG-1SFVC784I
XCZU2CG-1SFVC784I by Xilinx is a CMOS microprocessor circuit with 784 terminals in a square grid array package. Operating b/w -40 to 100 °C, it has a peak reflow temp of 250C. Ideal for industrial applications requiring low voltage supply and high processing power.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TMS320DM368ZCED48F
TMS320DM368ZCED48F by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a max supply voltage of 1.42V and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.
TMS320DM368ZCEDF
TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.
TMS320DM368ZCED
TMS320DM368ZCED by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile grid array package with a 0.65 mm terminal pitch.
TMS320DM368ZCE
TMS320DM368ZCE by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses for various applications requiring low profile and fine pitch package style. The processor has a supply voltage range of 1.28-1.8V and features a grid array package with a terminal pitch of 0.65mm.
TMS320DM368ZCEF
TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.
TMS320F28PLC84PNT
TMS320F28PLC84PNT by Texas Instruments is an 80-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 105°C, suitable for industrial applications. With a supply voltage range of 2.97-3.63V, it is designed for surface mount assembly in compact spaces.
TMS320DM368ZCE48
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;
TMS320DM365ZCED30
TMS320DM365ZCED30 by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a 32-bit external data bus width and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package style with a grid array layout.
TMS320DM6446AZWTA
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;
TMS320DM6446AZWT
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;
TMS320DM365ZCE30
TMS320DM365ZCE30 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.42V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.
TMS320DM369ZCEDF
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;
TMS320DM355DZCE270
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
TMS320DM335ZCE270
TMS320DM355DZCE27J
TMS320DM355DZCEA13
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
TMS320DM335DZCEA13
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
TMS320DM335ZCEA135
TMS320DM355DZCEA21
TMS320DM355ZCE135
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$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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