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80312

Intel

80312 by Intel

Intel 80312 is a CMOS microprocessor circuit with 540 terminals in a square grid array package. It operates at a nominal voltage of 3.3V and has a max seated height of 4.1mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

$9.440

Lifecycle Status

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Distrelec

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Nova Conductors

Japan . 100 parts In-Stock

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$8.990

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Galco

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VNN

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Vyrian

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Digiode

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Abianca Electronics

United Arab Emirates . 66 parts In-Stock

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$8.720

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$8.371

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AZTECH Wire

Italy . 446 parts In-Stock

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Ampacity Inc.

Singapore . 5 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 4,827 parts In-Stock

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Corphita

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Overview

Experience unparalleled performance and reliability with the Intel 80312. Crafted by the industry leader in microprocessor technology, this cutting-edge product offers a wide array of applications for various functions. From embedded systems to smart devices, the possibilities are endless. With a focus on quality and innovation, Intel delivers a superior product that guarantees efficiency and seamless operation. Upgrade your technology with the Intel 80312 and enjoy a new level of performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the IC, ensuring reliable performance in various environmental conditions.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and making it suitable for compact electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, offering flexibility in power requirements for different applications.

Package Shape: SQUARE

Square shape facilitates easier PCB layout and ensures efficient use of space within electronic devices.

No. of Terminals: 540

High number of terminals allows for versatile connectivity options and enables the IC to support complex circuit configurations.

Package Style (Meter): GRID ARRAY

Grid array package style offers secure connections and facilitates heat dissipation, enhancing the overall performance and reliability of the IC.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB assembly and enhances the overall mechanical stability of the IC within the system.

Maximum Seated Height: 4.1 mm

Low seated height allows for a compact design and easy integration into space-constrained electronic devices.

Width: 42.5 mm

Optimal width dimension provides a balance between space efficiency and connectivity options, making it suitable for various applications.

Length: 42.5 mm

Symmetrical length dimension ensures uniform distribution of terminals and facilitates consistent PCB layout, enhancing overall reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit functionality enables advanced processing capabilities, making the IC suitable for applications requiring high-performance computing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient performance and reliability in diverse operating conditions.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and improves thermal conductivity, enhancing the overall performance and longevity of the IC.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, enhancing overall reliability.

Terminal Pitch: 1.27 mm

Fine terminal pitch enables high-density mounting and enhances connectivity options, making it suitable for applications requiring precise electrical connections.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 80312 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

JESD-30 Code:

S-PBGA-B540

Length:

42.5 mm

No. of Terminals:

540

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

42.5 mm

Peripheral IC Type:

Trade Compliance

80312 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

1650-15-052-0752, 1650150520752, 4820-25-142-8682, 4820251428682, 5305-00-290-2574, 5305002902574, 5330-01-027-2895, 5330010272895, 5342-01-144-6081, 5342011446081, 5365-14-206-0756, 5365142060756, 5821-00-332-4676, 5821003324676, 5820-25-149-6498, 5820251496498, 5950-00-688-7541, 5950006887541, 5985-99-522-5868, 5985995225868, 7045-01-068-5804, 7045010685804, 7920-00-514-2417, 7920005142417

NIIN

150520752, 251428682, 002902574, 010272895, 011446081, 142060756, 003324676, 251496498, 006887541, 995225868, 010685804, 005142417

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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