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TMS320DM6467CZUTAV

Texas Instruments

TMS320DM6467CZUTAV by Texas Instruments

TMS320DM6467CZUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It has a package style of GRID ARRAY, FINE PITCH and terminal finish of TIN SILVER COPPER. Ideal for industrial applications requiring high processing power in compact form factor.

Median Price

$112.792

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 883 parts In-Stock

1+ parts

-

100+ parts

$100.260

1k+ parts

$89.710

10k+ parts

$84.430

883

-

$100.260

$89.710

$84.430

DigiKey

USA . 883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

883

-

-

-

-

Verical

USA . 804 parts In-Stock

1+ parts

-

100+ parts

$125.325

1k+ parts

$112.138

10k+ parts

$105.537

804

-

$125.325

$112.138

$105.537

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,473 parts In-Stock

1+ parts

$105.830

100+ parts

-

1k+ parts

-

10k+ parts

-

4,473

$105.830

-

-

-

DigiKey Marketplace

USA . 883 parts In-Stock

1+ parts

$115.860

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$115.860

-

-

-

Vyrian

USA . 2,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,558

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$46.057

100+ parts

$41.912

1k+ parts

$37.767

10k+ parts

-

2,500

$46.057

$41.912

$37.767

-

Parana Technologies

USA . 2,304 parts In-Stock

1+ parts

$58.212

100+ parts

-

1k+ parts

-

10k+ parts

-

2,304

$58.212

-

-

-

DigiPath Technology Company

USA . 641 parts In-Stock

1+ parts

$64.099

100+ parts

$58.971

1k+ parts

-

10k+ parts

-

641

$64.099

$58.971

-

-

ChromeModa Solutions

Germany . 5,719 parts In-Stock

1+ parts

$65.407

100+ parts

$53.634

1k+ parts

-

10k+ parts

-

5,719

$65.407

$53.634

-

-

IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$65.407

100+ parts

$62.137

1k+ parts

$58.866

10k+ parts

-

905

$65.407

$62.137

$58.866

-

Corohmni

South Africa . 1,242 parts In-Stock

1+ parts

$65.408

100+ parts

-

1k+ parts

-

10k+ parts

-

1,242

$65.408

-

-

-

Corphita

USA . 3,743 parts In-Stock

1+ parts

$100.260

100+ parts

-

1k+ parts

-

10k+ parts

-

3,743

$100.260

-

-

-

Microchip USA

USA . 2,589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,589

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320DM6467CZUTAV by Texas Instruments. This innovative product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering unmatched quality and reliability. With a wide range of applications, this device is designed to meet the needs of various industries. Experience seamless performance and efficiency with its advanced features, making it the perfect choice for your next project. Trust in Texas Instruments to provide you with top-notch solutions that deliver exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, saving space and improving overall product performance.

Maximum Supply Voltage: 1.26 V

This voltage range is suitable for various applications, providing flexibility and compatibility with different power sources.

Package Shape: SQUARE

The square shape of the package allows for easier placement and installation in circuit boards, optimizing space and layout.

Bit Size: 32

The 32-bit architecture provides high performance and processing capabilities, making the product suitable for advanced tasks and computational needs.

Power Supplies (V): 1.2, 1.8, 3.3

Multiple power supply options offer versatility and compatibility with different systems and devices, enhancing the product's usability.

No. of Terminals: 529

The high number of terminals allows for a wide range of connections and configurations, increasing the product's functionality and interface options.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch provides precise alignment and connection, improving reliability and performance in electronic circuits.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures efficient power consumption and operation, enhancing the product's energy efficiency and longevity.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance enables the product to withstand harsh environmental conditions and maintain performance under stress.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable operation in cold environments, making the product suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides corrosion resistance and conductivity, ensuring stable connections and signal integrity in diverse operating conditions.

Terminal Position: BOTTOM

The bottom terminal position allows for easy mounting and soldering, facilitating assembly and maintenance processes for the product.

Maximum Seated Height: 3.3 mm

The low seated height profile enables compact design and space-saving integration, ideal for small form factor applications and devices.

RAM Words: 8192

The large RAM capacity supports high-speed data processing and storage, enhancing the product's performance in complex computing tasks and applications.

Width: 19 mm

The moderate width size allows for easy handling and installation, providing convenience and flexibility in circuit board design and layout.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and bonding, guaranteeing reliable connections and long-lasting performance of the product.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance enables effective soldering and bonding, ensuring durable and stable connections in the product.

Length: 19 mm

The compact length size facilitates space-efficient layout and placement, contributing to overall system optimization and performance.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliability and durability in demanding operating environments, making the product suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality, enabling advanced computing tasks and applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, enhancing the product's efficiency and reliability in various applications.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, ensuring stable performance and signal integrity in the product's operation.

Nominal Supply Voltage: 1.2 V

The specified nominal supply voltage ensures consistent and stable power delivery, supporting reliable operation and performance of the product.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for precise connections and compact design, enhancing the product's overall efficiency and performance.

Format: FIXED POINT

The fixed-point format enables accurate and efficient numerical calculations, making the product suitable for precise computational tasks and algorithms.

Moisture Sensitivity Level (MSL): 4

The MSL level indicates the product's resistance to moisture and environmental factors, ensuring long-term reliability and stability in various conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CZUTAV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CZUTAV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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