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TMS320DM6467CZUTD7

Texas Instruments

TMS320DM6467CZUTD7 by Texas Instruments

TMS320DM6467CZUTD7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.26 V and supports power supplies of 1.2, 1.8, and 3.3 V. Ideal for industrial applications requiring a high-performance microprocessor circuit in a compact square package style with grid array terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,605 parts In-Stock

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8,605

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Digiode

USA . 2,810 parts In-Stock

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2,810

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Distributors (Availability)

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AZTECH Wire

Italy . 287 parts In-Stock

1+ parts

$5.237

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287

$5.237

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Corohmni

South Africa . 582 parts In-Stock

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$15.554

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582

$15.554

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Parana Technologies

USA . 1,057 parts In-Stock

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$18.763

100+ parts

$1,742.427

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$16.887

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1,057

$18.763

$1,742.427

$16.887

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One Stop Electronics

USA . 1,048 parts In-Stock

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$20.000

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1,048

$20.000

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DigiPath Technology Company

USA . 1,782 parts In-Stock

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$20.660

100+ parts

$19.008

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1,782

$20.660

$19.008

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ChromeModa Solutions

Germany . 1,209 parts In-Stock

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$21.082

100+ parts

$17.287

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1,209

$21.082

$17.287

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IDEA Electronic Components Group

UK . 1,198 parts In-Stock

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$21.082

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$20.028

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$18.974

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1,198

$21.082

$20.028

$18.974

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Component Stockers USA

USA . 673 parts In-Stock

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$99.990

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673

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Corphita

USA . 3,616 parts In-Stock

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Microchip USA

USA . 2,438 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320DM6467CZUTD7 by Texas Instruments. This versatile microprocessor circuit offers unparalleled performance and reliability, making it ideal for a wide range of applications in various industries. With its innovative design and advanced features, this product delivers exceptional value to customers looking for high-quality solutions that deliver results. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving time and labor costs during production.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and prevents damage to the product, enhancing its reliability.

Bit Size: 32

With a bit size of 32, the product offers high computational capabilities and can handle complex tasks efficiently.

Power Supplies (V): 1.2, 1.8, 3.3

Supporting multiple power supply voltages enables flexibility in design and compatibility with various system requirements.

No. of Terminals: 529

Having a high number of terminals allows for versatile connectivity options and integration with external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provides high density integration, saving space on the PCB and enabling compact designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C ensures reliable performance in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures good electrical conductivity and reliable solder connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC enhances the product's processing capabilities and enables advanced functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CZUTD7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CZUTD7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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