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TMS320DM6467TZUT1

Texas Instruments

TMS320DM6467TZUT1 by Texas Instruments

TMS320DM6467TZUT1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85 °C. It has a max supply voltage of 1.365 V and is suitable for MICROPROCESSOR CIRCUIT applications due to its CMOS technology and fine pitch package style.

Median Price

$148.540

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

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$148.540

100+ parts

$139.630

1k+ parts

$126.260

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1

$148.540

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$126.260

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Distributors (In-Stock)

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Digiode

USA . 2,242 parts In-Stock

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$141.113

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Vyrian

USA . 5,189 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 305 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Elcom Components

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Prism Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 426 parts In-Stock

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$10.310

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Parana Technologies

USA . 2,365 parts In-Stock

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$44.910

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$44.910

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DigiPath Technology Company

USA . 1,808 parts In-Stock

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$49.452

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ChromeModa Solutions

Germany . 2,355 parts In-Stock

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$50.461

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$41.378

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IDEA Electronic Components Group

UK . 452 parts In-Stock

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$50.461

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$47.938

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$45.415

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Corohmni

South Africa . 9 parts In-Stock

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$82.618

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Corphita

USA . 2,137 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,075 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,182 parts In-Stock

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Microchip USA

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Emar International I/E

Canada . 28 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320DM6467TZUT1 by Texas Instruments. Known for their cutting-edge technology and innovation, Texas Instruments delivers top-quality products like this one, perfect for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category. With a focus on delivering value and benefits to customers, this product offers advanced features and capabilities that will elevate your projects to new heights. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into electronic devices for efficient assembly.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation and prevents damage to the product.

Package Shape: SQUARE

The square package shape allows for easier handling and placement during assembly.

Bit Size: 32

With a bit size of 32, this product offers high processing capability for complex tasks.

Power Supplies (V): 1.3, 1.8/3.3

The multiple power supply options give flexibility in choosing the appropriate voltage for different applications.

No. of Terminals: 529

Having 529 terminals provides connectivity for various external components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density mounting and space-saving design.

Minimum Supply Voltage: 1.235 V

The lower minimum supply voltage of 1.235 V allows for efficient power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C makes this product suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy soldering and connection to the circuit board.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3 mm allows for a compact design and efficient use of space in electronic devices.

RAM Words: 8192

With 8192 RAM words, this product offers ample memory for storing and processing data efficiently.

Width: 19 mm

The compact width of 19 mm allows for easy integration into electronic circuits with limited space.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without damaging the product.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, the product can withstand high-temperature soldering processes.

Length: 19 mm

The product's length of 19 mm allows for a compact and space-efficient design in electronic applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product can perform complex calculations and tasks efficiently.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation for enhanced performance.

Terminal Form: BALL

The ball terminal form facilitates secure connections and reliable performance in electronic circuits.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V ensures stable and efficient operation of the product.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and space-saving design.

Format: FIXED POINT

The fixed-point format offers precise mathematical calculations and accuracy for various applications.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that this product is suitable for standard manufacturing and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467TZUT1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467TZUT1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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