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TMS320DM355CZCEA21

Texas Instruments

TMS320DM355CZCEA21 by Texas Instruments

TMS320DM355CZCEA21 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100 °C. It features a 1.3 V nominal voltage, I2C, SPI, UART, USB compatibility and is ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a SQUARE package with PLASTIC/EPOXY body material.

Median Price

$29.544

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,326 parts In-Stock

1+ parts

$29.544

100+ parts

$26.262

1k+ parts

$19.310

10k+ parts

-

1,326

$29.544

$26.262

$19.310

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,665 parts In-Stock

1+ parts

$28.067

100+ parts

-

1k+ parts

-

10k+ parts

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2,665

$28.067

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-

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Vyrian

USA . 8,312 parts In-Stock

1+ parts

-

100+ parts

-

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8,312

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Chip Stock

USA . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$15.320

100+ parts

-

1k+ parts

-

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526

$15.320

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-

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Corphita

USA . 1,538 parts In-Stock

1+ parts

$26.590

100+ parts

-

1k+ parts

-

10k+ parts

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1,538

$26.590

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-

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Parana Technologies

USA . 418 parts In-Stock

1+ parts

$34.099

100+ parts

-

1k+ parts

$142.291

10k+ parts

-

418

$34.099

-

$142.291

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Corohmni

South Africa . 2,635 parts In-Stock

1+ parts

$36.479

100+ parts

-

1k+ parts

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2,635

$36.479

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DigiPath Technology Company

USA . 298 parts In-Stock

1+ parts

$37.548

100+ parts

-

1k+ parts

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298

$37.548

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ChromeModa Solutions

Germany . 1,495 parts In-Stock

1+ parts

$38.314

100+ parts

$31.417

1k+ parts

-

10k+ parts

-

1,495

$38.314

$31.417

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IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$38.314

100+ parts

$36.398

1k+ parts

$34.483

10k+ parts

-

1,389

$38.314

$36.398

$34.483

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Microchip USA

USA . 1,595 parts In-Stock

1+ parts

$68.180

100+ parts

$67.000

1k+ parts

$66.400

10k+ parts

$65.810

1,595

$68.180

$67.000

$66.400

$65.810

Overview

Unlock the potential of your electronics projects with the TMS320DM355CZCEA21 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. This versatile microprocessor circuit is suitable for a wide range of applications, offering customers unmatched value and benefits. Whether you're designing consumer electronics, industrial automation systems, or communications equipment, this product provides the features and capabilities you need to bring your ideas to life. Experience the power of innovation with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure mounting on the circuit board, saving space and improving efficiency.

Maximum Supply Voltage: 1.365 V

Operates efficiently within a specified voltage range, ensuring stable performance.

Bit Size: 32

Offers a high processing capability with a 32-bit architecture, suitable for complex computations.

Power Supplies (V): 1.3,1.8,3.3

Compatibility with multiple power supply voltages increases flexibility for different applications.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions, making it versatile for various applications.

RAM Words: 8192

Provides ample memory capacity for data storage and processing requirements.

Bus Compatibility: I2C; SPI; UART; USB

Supports multiple bus protocols for versatile connectivity options with other devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, enhancing efficiency.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure, ensuring reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM355CZCEA21 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM355CZCEA21 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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