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TMS320DM355DZCE216

Texas Instruments

TMS320DM355DZCE216 by Texas Instruments

TMS320DM355DZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at 1.3V nominal voltage and supports I2C, SPI, UART, and USB buses. Ideal for applications requiring low profile, fine pitch package style in the temperature range of 0-85°C.

Median Price

$33.816

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,266 parts In-Stock

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$28.391

100+ parts

$24.799

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$17.103

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1,266

$28.391

$24.799

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DigiKey

USA . 110 parts In-Stock

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$39.240

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$30.168

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$39.240

$30.168

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Distributors (In-Stock)

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Digiode

USA . 2,525 parts In-Stock

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$22.942

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$22.942

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Nova Conductors

Japan . 26 parts In-Stock

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$24.920

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Chip Stock

USA . 3,982 parts In-Stock

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Vyrian

USA . 3,266 parts In-Stock

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TME

Poland . 520 parts In-Stock

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$28.690

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520

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 319 parts In-Stock

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$20.530

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319

$20.530

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Corphita

USA . 1,584 parts In-Stock

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$21.735

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$21.735

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Netroflash

USA . 2,000 parts In-Stock

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$24.920

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$24.920

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Corohmni

South Africa . 4,992 parts In-Stock

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$73.203

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Parana Technologies

USA . 2,360 parts In-Stock

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$74.836

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DigiPath Technology Company

USA . 635 parts In-Stock

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$82.403

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$75.811

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635

$82.403

$75.811

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ChromeModa Solutions

Germany . 3,145 parts In-Stock

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$84.085

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$68.950

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$84.085

$68.950

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IDEA Electronic Components Group

UK . 667 parts In-Stock

1+ parts

$84.085

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$79.881

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$75.676

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667

$84.085

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$75.676

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Lixinc

USA . 12,236 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 5,090 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 560 parts In-Stock

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Electronic Sources GmbH

Germany . 13 parts In-Stock

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Overview

Experience cutting-edge technology with the TMS320DM355DZCE216 by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers exceptional performance in the category of Other Function uPs,uCs & Peripheral ICs. With a 32-bit architecture and a wide range of power supplies, this product offers unparalleled value and benefits to customers. Whether you're looking to enhance your microprocessor circuits or optimize your system's performance, the TMS320DM355DZCE216 is the perfect solution. Elevate your projects with this innovative and reliable device today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable, lightweight, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.365 V

Provides a balanced voltage level to ensure smooth and stable operation of the product.

Package Shape: SQUARE

Square packages are space-efficient and allow for closer packing on circuit boards, maximizing use of available space.

Bit Size: 32

A 32-bit architecture offers high processing power and efficiency, suitable for handling complex tasks and data processing.

Power Supplies (V): 1.3,1.8,3.3

Supports a variety of power supply voltages, making the product versatile and compatible with different systems.

No. of Terminals: 337

Having a high number of terminals enables efficient connectivity and communication with other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design, precise pin alignment, and high-density integration for optimal performance.

Minimum Supply Voltage: 1.235 V

Ensures the product can operate reliably even with lower voltage inputs, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures ensures product reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance, conductivity, and reliability to ensure long-term functionality of the product.

RAM Words: 8192

Ample RAM capacity for data storage and processing, enhancing the product's performance and capability.

Width: 13 mm

Compact width size allows for easy integration into various electronic devices and applications.

External Data Bus Width: 32

A 32-bit external data bus width enables efficient data transfer and processing, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process, contributing to the product's reliability and durability.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes, ensuring product quality and reliability.

Length: 13 mm

Compact length size allows for flexibility in design and integration, making the product suitable for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of a microprocessor circuit enhances the product's processing capabilities and functionality for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminals provide secure and reliable connections, facilitating efficient communication and operation of the product.

Nominal Supply Voltage: 1.3 V

Stable and reliable nominal supply voltage ensures consistent performance and operation of the product.

Bus Compatibility: I2C; SPI; UART; USB

Support for multiple bus interfaces enables seamless integration with various communication protocols and devices, enhancing versatility.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density packaging and efficient connectivity, maximizing board space utilization.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency of the product.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand moderate exposure to moisture during transportation and storage, ensuring product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM355DZCE216 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM355DZCE216 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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