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TMS320DM6441AZWT

Texas Instruments

TMS320DM6441AZWT by Texas Instruments

TMS320DM6441AZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words, operating at temperatures from 0 to 85°C. It features a package style of grid array, low profile, fine pitch and supports bus compatibility with Ethernet, I2C, SPI, UART, and USB. Ideal for applications requiring high-performance processing in compact spaces.

Median Price

$43.764

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

1+ parts

$33.370

100+ parts

$32.700

1k+ parts

$32.040

10k+ parts

-

9

$33.370

$32.700

$32.040

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Texas Instruments

USA . 179 parts In-Stock

1+ parts

$43.764

100+ parts

$38.901

1k+ parts

$28.604

10k+ parts

-

179

$43.764

$38.901

$28.604

-

DigiKey

USA . 90 parts In-Stock

1+ parts

$68.950

100+ parts

$51.151

1k+ parts

$49.910

10k+ parts

-

90

$68.950

$51.151

$49.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 309 parts In-Stock

1+ parts

$33.196

100+ parts

$28.090

1k+ parts

$27.221

10k+ parts

-

309

$33.196

$28.090

$27.221

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Digiode

USA . 3,388 parts In-Stock

1+ parts

$34.532

100+ parts

-

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3,388

$34.532

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Vyrian

USA . 5,049 parts In-Stock

1+ parts

-

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5,049

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Chip Stock

USA . 4,548 parts In-Stock

1+ parts

-

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4,548

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Dan-Mar Components

USA . 309 parts In-Stock

1+ parts

-

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309

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

1+ parts

-

100+ parts

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2

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MISTER SPROCKETS

USA . 2 parts In-Stock

1+ parts

-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 530 parts In-Stock

1+ parts

$20.814

100+ parts

-

1k+ parts

$20.977

10k+ parts

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530

$20.814

-

$20.977

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DigiPath Technology Company

USA . 1,541 parts In-Stock

1+ parts

$22.919

100+ parts

-

1k+ parts

-

10k+ parts

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1,541

$22.919

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ChromeModa Solutions

Germany . 6,988 parts In-Stock

1+ parts

$23.387

100+ parts

$19.177

1k+ parts

-

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6,988

$23.387

$19.177

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IDEA Electronic Components Group

UK . 1,968 parts In-Stock

1+ parts

$23.387

100+ parts

$22.218

1k+ parts

$21.048

10k+ parts

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1,968

$23.387

$22.218

$21.048

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Corphita

USA . 2,604 parts In-Stock

1+ parts

$32.715

100+ parts

-

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2,604

$32.715

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Corohmni

South Africa . 442 parts In-Stock

1+ parts

$86.699

100+ parts

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442

$86.699

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Microchip USA

USA . 458 parts In-Stock

1+ parts

$118.930

100+ parts

$116.860

1k+ parts

$115.830

10k+ parts

$114.800

458

$118.930

$116.860

$115.830

$114.800

S.R.D Solutions

India . 11,000 parts In-Stock

1+ parts

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11,000

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A-Z Elektronik GmbH

Germany . 5,465 parts In-Stock

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5,465

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Assy Fe

Spain . 3,214 parts In-Stock

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Kepictronics

USA . 71 parts In-Stock

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71

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ChipstoGo Electronic ltd

UK . 67 parts In-Stock

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Overview

Elevate your projects with the TMS320DM6441AZWT by Texas Instruments, a top-tier manufacturer known for quality and innovation in the realm of Other Function uPs,uCs & Peripheral ICs. This powerful microprocessor circuit offers unmatched performance, versatility, and reliability, making it an ideal choice for a wide range of applications. With a focus on efficiency and cutting-edge technology, this product provides customers with value, benefits, and advantages that are second to none. Upgrade your designs today with the TMS320DM6441AZWT and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 1.1 V

Operates efficiently within a low maximum supply voltage, making it energy-efficient and suitable for low-power applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate, making it a space-saving option for designs with limited space.

Bit Size: 32

With a 32-bit size, the product offers high processing power and capability to handle complex tasks effectively.

Power Supplies (V): 1.2, 1.8, 3.3

Offers flexibility in power supply options, allowing for compatibility with a range of voltage inputs for versatile use.

No. of Terminals: 361

The high number of terminals provides ample connectivity options for various external devices and components, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style with grid array, low profile, and fine pitch design offers efficient thermal management, space-saving, and high-density integration capabilities.

Minimum Supply Voltage: 1 V

Operates at a low minimum supply voltage, allowing for energy-efficient performance and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliable performance in challenging environments and applications.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, providing versatility for use in a wide range of environmental settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish with tin silver copper provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, ensuring ease of integration into the system.

Maximum Seated Height: 1.4 mm

With a low maximum seated height, the product offers a compact form factor, ideal for space-constrained designs.

RAM Words: 16384

The large RAM capacity of 16384 words enables efficient data processing and storage for handling complex operations and applications.

Width: 16 mm

The compact width of 16mm allows for space-efficient placement on the PCB, ideal for designs with limited board space.

External Data Bus Width: 48

With a wide external data bus width of 48 bits, the product can handle high-speed data transfer and processing efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures of 260°C, ensuring robust solder joints and durability during assembly.

Length: 16 mm

The compact length of 16mm allows for space-efficient placement on the PCB, ideal for designs with limited board space.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type, the product offers advanced processing capabilities and versatile functionality.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed, and reliable operation for efficient performance.

Terminal Form: BALL

The terminal form with ball design offers reliable connections and facilitates easy soldering during assembly.

Nominal Supply Voltage: 1.05 V

Operates at a nominal supply voltage of 1.05V, providing stable performance and power efficiency for various applications.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Compatibility with multiple bus interfaces including Ethernet, I2C, SPI, UART, and USB allows for versatile connectivity and communication options.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm enables high-density mounting and efficient use of PCB space for compact designs.

Format: FIXED POINT

Operating in a fixed-point format ensures precise calculations and accurate data processing for reliable performance.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product offers enhanced protection against moisture-related damage, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6441AZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6441AZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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