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TMS320DM6467TZUTD1

Texas Instruments

TMS320DM6467TZUTD1 by Texas Instruments

TMS320DM6467TZUTD1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.365 V and is ideal for industrial applications requiring MICROPROCESSOR CIRCUIT technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,489 parts In-Stock

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4,489

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Digiode

USA . 2,061 parts In-Stock

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2,061

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Distributors (Availability)

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AZTECH Wire

Italy . 455 parts In-Stock

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$11.983

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455

$11.983

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Parana Technologies

USA . 243 parts In-Stock

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$16.226

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$16.539

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243

$16.226

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$16.539

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DigiPath Technology Company

USA . 401 parts In-Stock

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$17.867

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$16.438

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401

$17.867

$16.438

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ChromeModa Solutions

Germany . 5,784 parts In-Stock

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$18.232

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$14.950

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5,784

$18.232

$14.950

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IDEA Electronic Components Group

UK . 1,588 parts In-Stock

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$18.232

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$17.320

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$16.409

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$18.232

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$16.409

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One Stop Electronics

USA . 456 parts In-Stock

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$34.000

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456

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Corohmni

South Africa . 23 parts In-Stock

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$39.170

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Component Stockers USA

USA . 756 parts In-Stock

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$99.990

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Corphita

USA . 2,566 parts In-Stock

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Microchip USA

USA . 1,891 parts In-Stock

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Overview

Unlock limitless possibilities with the TMS320DM6467TZUTD1 by Texas Instruments, a cutting-edge microprocessor circuit designed for industrial-grade applications. This square-shaped marvel boasts a 32-bit architecture and a whopping 8192 RAM words to power your projects with unparalleled speed and efficiency. With Texas Instruments' reputation for quality and innovation backing it up, this versatile IC promises to revolutionize the way you approach embedded systems. Say goodbye to limitations and hello to endless opportunities with the TMS320DM6467TZUTD1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving time and facilitating automated manufacturing processes.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation without risking damage due to overvoltage, enhancing the product's reliability.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates a more organized layout of components on the PCB.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency, making the product suitable for complex computations and high-performance applications.

Power Supplies (V): 1.3, 1.8/3.3

Support for multiple power supply voltages allows for versatility in different system configurations, accommodating various power requirements.

No. of Terminals: 529

The high number of terminals enables the product to interface with multiple external devices and peripherals, expanding its connectivity options.

Package Style: GRID ARRAY, FINE PITCH

The grid array fine pitch package style offers high density packaging, reducing board space usage and improving overall system integration.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V ensures stable operation even in low voltage conditions, enhancing the product's versatility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand elevated temperatures without compromising performance, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable functionality in extreme cold conditions, ideal for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper finish on terminals provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, enabling easier access and connection to other components in the system.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3 mm allows for a compact design, reducing overall system profile and enabling space-efficient installations.

RAM Words: 8192

The inclusion of 8192 RAM words provides ample memory capacity for data storage and processing, supporting efficient operation in various applications.

Width: 19 mm

With a width of 19 mm, the product offers a compact form factor, making it suitable for integration into space-constrained devices or systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and thermal management during the assembly process.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures effective soldering and component bonding, contributing to the overall reliability of the product.

Length: 19 mm

The 19 mm length of the product contributes to its compact size and facilitates easier integration into various electronic systems and devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature standards ensures the product's reliability and stability in harsh operating environments, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities, enabling advanced functions and features.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and mechanical strength, ensuring secure attachment and long-term performance.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V provides stable power delivery for consistent performance, meeting the operational requirements of the product.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high-density mounting on PCBs, enhancing connectivity and facilitating efficient signal routing.

Format: FIXED POINT

The fixed-point format supports precise numeric calculations and processing, suitable for applications requiring accurate mathematical operations.

Moisture Sensitivity Level (MSL): 4

The MSL level of 4 indicates that the product has a moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467TZUTD1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467TZUTD1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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