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CP3SP33SMS/NOPB

Texas Instruments

CP3SP33SMS/NOPB by Texas Instruments

CP3SP33SMS/NOPB by Texas Instruments is a 16-bit microprocessor with 32-bit external data bus width, operating at speeds up to 96 rpm. It features a low profile grid array package style with 224 terminals and supports I2C, I2S, SPI, UART, and USB buses. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$23.538

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,423 parts In-Stock

1+ parts

-

100+ parts

$18.830

1k+ parts

$16.850

10k+ parts

$15.860

2,423

-

$18.830

$16.850

$15.860

Verical

USA . 1,237 parts In-Stock

1+ parts

-

100+ parts

$23.538

1k+ parts

$21.063

10k+ parts

$19.825

1,237

-

$23.538

$21.063

$19.825

DigiKey

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$24.780

1k+ parts

-

10k+ parts

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73

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$24.780

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,095 parts In-Stock

1+ parts

$19.874

100+ parts

-

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3,095

$19.874

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Vyrian

USA . 3,147 parts In-Stock

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3,147

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DigiKey Marketplace

USA . 2,423 parts In-Stock

1+ parts

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2,423

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Sternenhof Electronics

Switzerland . 152 parts In-Stock

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152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 256 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

-

10k+ parts

$0.180

256

$0.187

-

-

$0.180

Northwest PG Solutions

USA . 459 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

$0.181

459

$0.206

-

-

$0.181

Corphita

USA . 171 parts In-Stock

1+ parts

$18.828

100+ parts

-

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171

$18.828

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Microchip USA

USA . 2,754 parts In-Stock

1+ parts

$55.282

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2,754

$55.282

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Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$75.212

100+ parts

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2,100

$75.212

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Corohmni

South Africa . 45 parts In-Stock

1+ parts

$82.239

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45

$82.239

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DigiPath Technology Company

USA . 1,469 parts In-Stock

1+ parts

$82.818

100+ parts

$76.192

1k+ parts

-

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1,469

$82.818

$76.192

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IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$84.508

100+ parts

$80.283

1k+ parts

$76.057

10k+ parts

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965

$84.508

$80.283

$76.057

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ChromeModa Solutions

Germany . 490 parts In-Stock

1+ parts

$84.508

100+ parts

$69.297

1k+ parts

-

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490

$84.508

$69.297

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Alle Elektronik GmbH

Germany . 3,891 parts In-Stock

1+ parts

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3,891

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Assy Fe

Spain . 1,782 parts In-Stock

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1,782

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Overview

Unlock the potential of your electronic designs with the CP3SP33SMS/NOPB by Texas Instruments. As a leader in the industry, Texas Instruments brings unmatched quality and reliability to their products. The CP3SP33SMS/NOPB falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With a focus on value and innovation, this product delivers superior performance and efficiency, making it the ideal choice for your next project. Trust Texas Instruments to provide the solutions you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to external elements, ensuring the product's longevity.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.98 V

The high maximum supply voltage ensures stable and reliable performance under varying input conditions.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

Bit Size: 16

16-bit processing capability enables the product to handle complex calculations and data manipulation efficiently.

Power Supplies (V): 1.8

Stable power supply at 1.8V ensures consistent performance and prevents damage to the internal components.

No. of Terminals: 224

Having a high number of terminals allows for versatile connectivity options, accommodating various external components.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style provides a compact and efficient design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments or industrial settings.

CPU Family: CR16C

Being part of the CR16C CPU family signifies compatibility with existing systems and familiarity with programming and development tools.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions without compromising performance.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish provides strong solder connections, ensuring secure attachment to the circuit board.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing space utilization and improving signal integrity.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables the product to be used in slim and compact electronic devices without sacrificing performance.

Width: 13 mm

13mm width allows for a compact and space-efficient design, suitable for applications where size constraints are a concern.

External Data Bus Width: 32

With a 32-bit external data bus width, the product can handle large amounts of data quickly and efficiently, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures proper solder reflow and connection integrity during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C allows for reliable and robust solder joints during the manufacturing process.

Length: 13 mm

13mm length contributes to a compact form factor, making the product suitable for applications with limited space available.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environments with fluctuating temperatures.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities and expands its functionality.

RAM Bytes: 32768

With 32768 bytes of RAM, the product can efficiently store and access data, enabling smooth and responsive operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides reliable and durable connections, ensuring long-term performance and stability.

Maximum Supply Current: 200 mA

Maximum supply current of 200mA allows the product to operate effectively without exceeding power limits or risking damage.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage of 1.8V ensures stable and consistent power delivery to the product, maintaining optimal performance levels.

Bus Compatibility: I2C; I2S; SPI; UART; USB

Compatibility with various bus protocols (I2C, I2S, SPI, UART, USB) facilitates seamless integration with different devices and systems.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the product allows for precise and secure soldering, ensuring reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent damage.

Speed: 96 rpm

With a speed of 96 rpm, the product can process data and execute instructions quickly, enhancing overall performance and responsiveness.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CP3SP33SMS/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; I2S; SPI; UART; USB

CPU Family:

CR16C

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B224

JESD-609 Code:

e0

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

224

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA224,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

RAM Bytes:

32768

Maximum Seated Height:

1.4 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

CP3SP33SMS/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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