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CP3SP33SMSX/NOPB

Texas Instruments

CP3SP33SMSX/NOPB by Texas Instruments

CP3SP33SMSX/NOPB by Texas Instruments is a 16-bit microprocessor with 32-bit external data bus width, operating at speeds up to 96 rpm. It features a low profile grid array package style with 224 terminals and supports various bus compatibilities like I2C, I2S, SPI, UART, and USB. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$23.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$21.680

100+ parts

$18.937

1k+ parts

$13.060

10k+ parts

-

1,500

$21.680

$18.937

$13.060

-

Rochester

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

$23.350

1k+ parts

$20.890

10k+ parts

$19.660

4,700

-

$23.350

$20.890

$19.660

DigiKey

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Verical

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

$29.188

1k+ parts

$26.113

10k+ parts

$24.575

2,700

-

$29.188

$26.113

$24.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,788 parts In-Stock

1+ parts

$17.233

100+ parts

-

1k+ parts

-

10k+ parts

-

4,788

$17.233

-

-

-

Vyrian

USA . 4,095 parts In-Stock

1+ parts

$18.140

100+ parts

-

1k+ parts

-

10k+ parts

-

4,095

$18.140

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 183 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

-

183

$0.508

-

-

-

Northwest PG Solutions

USA . 1,422 parts In-Stock

1+ parts

$0.559

100+ parts

-

1k+ parts

-

10k+ parts

$0.493

1,422

$0.559

-

-

$0.493

Corphita

USA . 1,071 parts In-Stock

1+ parts

$16.326

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$16.326

-

-

-

Microchip USA

USA . 2,085 parts In-Stock

1+ parts

$51.195

100+ parts

-

1k+ parts

-

10k+ parts

-

2,085

$51.195

-

-

-

Parana Technologies

USA . 1,740 parts In-Stock

1+ parts

$53.386

100+ parts

-

1k+ parts

-

10k+ parts

-

1,740

$53.386

-

-

-

Corohmni

South Africa . 200 parts In-Stock

1+ parts

$56.828

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$56.828

-

-

-

ChromeModa Solutions

Germany . 2,286 parts In-Stock

1+ parts

$59.984

100+ parts

$49.187

1k+ parts

-

10k+ parts

-

2,286

$59.984

$49.187

-

-

IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$59.984

100+ parts

$56.985

1k+ parts

$53.986

10k+ parts

-

1,749

$59.984

$56.985

$53.986

-

Kepictronics

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,700

-

-

-

-

DigiPath Technology Company

USA . 1,865 parts In-Stock

1+ parts

-

100+ parts

$54.082

1k+ parts

-

10k+ parts

-

1,865

-

$54.082

-

-

Overview

Unleash the power of cutting-edge technology with the CP3SP33SMSX/NOPB by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This versatile microprocessor circuit offers a wide range of applications in the realm of Other Function uPs, uCs & Peripheral ICs, providing customers with unparalleled value and performance. With its innovative design, advanced features, and industrial-grade durability, this product is the perfect solution for your electronic needs. Embrace the future of technology with Texas Instruments and take your projects to new heights with the CP3SP33SMSX/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the product, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto a circuit board, streamlining the manufacturing process of the product.

Maximum Supply Voltage: 1.98 V

With a maximum supply voltage of 1.98V, this product is energy-efficient and can operate within a low power consumption range.

Package Shape: SQUARE

The square package shape ensures efficient use of space on a circuit board, making it a compact and space-saving choice for electronic designs.

Bit Size: 16

A bit size of 16 allows for efficient processing and handling of data, making this product suitable for applications that require moderate computational power.

Power Supplies (V): 1.8

Operating at a nominal supply voltage of 1.8V, this product is optimized for low power consumption and energy efficiency.

No. of Terminals: 224

Having 224 terminals provides ample connectivity options, enabling the product to interface with various external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures precise and secure mounting on a circuit board, enhancing the overall reliability of the product.

Minimum Supply Voltage: 1.62 V

With a minimum supply voltage of 1.62V, this product can operate reliably even under low voltage conditions, making it versatile in various electronic applications.

Maximum Operating Temperature: 85 °C

The product can operate efficiently at temperatures up to 85°C, making it suitable for industrial and high-temperature environments.

CPU Family: CR16C

The CR16C CPU family offers optimized performance and efficiency, making this product ideal for processing tasks in resource-constrained applications.

Minimum Operating Temperature: -40 °C

Capable of operating in temperatures as low as -40°C, this product is reliable in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN LEAD

The TIN LEAD terminal finish ensures secure connections and prevents oxidation, enhancing the longevity and reliability of the product.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy soldering and installation onto a circuit board, simplifying the assembly process of the product.

Maximum Seated Height: 1.4 mm

With a maximum seated height of 1.4mm, this product is low-profile and compact, making it suitable for space-constrained electronic designs.

Width: 13 mm

The 13mm width of the product ensures a compact form factor, enabling it to be easily integrated into various electronic devices and systems.

External Data Bus Width: 32

An external data bus width of 32 allows for efficient data transfer and processing, making this product suitable for applications that require high-speed data communication.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and controlled soldering processes, preventing damage to the product during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring reliable connections on a circuit board.

Length: 13 mm

The 13mm length of the product contributes to its compact form factor, making it suitable for integration into small electronic devices and applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to operate reliably in harsh industrial environments, making it a robust and rugged choice for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities and versatile functionalities, making it suitable for a wide range of applications that require complex computational tasks.

RAM Bytes: 32768

With 32768 RAM bytes, this product provides sufficient memory for buffering and data storage, enabling efficient multitasking and data processing capabilities.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable in electronic applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and facilitates efficient soldering onto a circuit board, enhancing the overall reliability and performance of the product.

Maximum Supply Current: 200 mA

With a maximum supply current of 200mA, this product operates within a low current consumption range, making it energy-efficient and suitable for battery-powered devices.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V, this product is optimized for power efficiency and reliable performance in a variety of electronic applications.

Bus Compatibility: I2C; I2S; SPI; UART; USB

Supporting various bus interfaces like I2C, I2S, SPI, UART, and USB, this product offers versatile connectivity options for seamless integration with external devices and peripherals.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product enables precise and compact mounting on a circuit board, ensuring secure connections and reliable performance.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that this product has moderate sensitivity to moisture, requiring standard precautions during storage and handling to maintain its reliability and performance.

Speed: 96 rpm

With a speed of 96 revolutions per minute, this product offers fast processing and data transfer capabilities, making it suitable for applications that require quick response times and high-speed operations.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CP3SP33SMSX/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; I2S; SPI; UART; USB

CPU Family:

CR16C

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B224

JESD-609 Code:

e0

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

224

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA224,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

RAM Bytes:

32768

Maximum Seated Height:

1.4 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

CP3SP33SMSX/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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