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CP3SP33SMR/NOPB

Texas Instruments

CP3SP33SMR/NOPB by Texas Instruments

CP3SP33SMR/NOPB by Texas Instruments is a 16-bit microprocessor with 32768 RAM bytes. Operating at speeds up to 96 rpm, it has a low profile grid array package style suitable for industrial applications. With a supply voltage range of 1.62V to 1.98V and operating temperature from -40°C to 85°C, it offers high performance in compact dimensions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,982 parts In-Stock

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Vyrian

USA . 2,380 parts In-Stock

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2,380

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One Stop Electronics

USA . 1,125 parts In-Stock

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$13.000

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$13.000

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AZTECH Wire

Italy . 876 parts In-Stock

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$19.363

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876

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Parana Technologies

USA . 2,150 parts In-Stock

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$53.701

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$53.701

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$59.131

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1,167

$59.131

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IDEA Electronic Components Group

UK . 2,309 parts In-Stock

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$60.338

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$57.321

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$54.304

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2,309

$60.338

$57.321

$54.304

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ChromeModa Solutions

Germany . 257 parts In-Stock

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$60.338

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$49.477

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257

$60.338

$49.477

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Corohmni

South Africa . 2,454 parts In-Stock

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$64.725

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Native Components

USA . 342 parts In-Stock

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$905.340

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$887.233

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$878.180

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$869.126

342

$905.340

$887.233

$878.180

$869.126

Northwest PG Solutions

USA . 1,283 parts In-Stock

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$995.874

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Corphita

USA . 499 parts In-Stock

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499

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Microchip USA

USA . 458 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the CP3SP33SMR/NOPB. This cutting-edge microprocessor circuit offers a wide range of applications in the field of Other Function uPs,uCs & Peripheral ICs, providing customers with superior performance and efficiency. With a focus on industrial-grade technology, this product boasts a 16-bit size and 32768 RAM bytes, making it ideal for a variety of projects. Trust in Texas Instruments to deliver top-notch solutions that exceed expectations and elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for a more compact design and enables easier automated assembly, saving time and cost during production.

Maximum Supply Voltage: 1.98 V

This higher supply voltage allows for better performance and stability in various applications.

Package Shape: SQUARE

The square shape makes it easier to align and place on a circuit board, improving overall efficiency during assembly.

Bit Size: 16

A 16-bit architecture offers improved processing capabilities and performance compared to lower bit sizes, making it suitable for more complex tasks.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and functionalities, making the product versatile in different applications.

Minimum Operating Temperature: -40 °C

Being able to operate in low temperatures makes this product suitable for use in a wide range of environments, including industrial settings.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making it an efficient choice for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CP3SP33SMR/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

CR16C

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

RAM Bytes:

32768

Maximum Seated Height:

1.4 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

CP3SP33SMR/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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