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TMS320DM365ZCE21

Texas Instruments

TMS320DM365ZCE21 by Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$17.548

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$9.220

100+ parts

$8.440

1k+ parts

-

10k+ parts

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150

$9.220

$8.440

-

-

Texas Instruments

USA . 155 parts In-Stock

1+ parts

$16.857

100+ parts

$14.725

1k+ parts

$10.155

10k+ parts

-

155

$16.857

$14.725

$10.155

-

Mouser Electronics

USA . 152 parts In-Stock

1+ parts

$24.300

100+ parts

$16.460

1k+ parts

$16.170

10k+ parts

-

152

$24.300

$16.460

$16.170

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Rochester

USA . 705 parts In-Stock

1+ parts

-

100+ parts

$14.590

1k+ parts

$13.060

10k+ parts

$12.290

705

-

$14.590

$13.060

$12.290

DigiKey

USA . 705 parts In-Stock

1+ parts

-

100+ parts

$19.200

1k+ parts

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705

-

$19.200

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Verical

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$18.238

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$16.325

10k+ parts

$15.363

266

-

$18.238

$16.325

$15.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,698 parts In-Stock

1+ parts

$13.252

100+ parts

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4,698

$13.252

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Vyrian

USA . 7,943 parts In-Stock

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7,943

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Cyclops Electronics Ltd

UK . 1,440 parts In-Stock

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1,440

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DigiKey Marketplace

USA . 705 parts In-Stock

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705

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Semtec, LLC

USA . 38 parts In-Stock

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38

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Distributors (Availability)

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Corphita

USA . 694 parts In-Stock

1+ parts

$12.555

100+ parts

-

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694

$12.555

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Corohmni

South Africa . 557 parts In-Stock

1+ parts

$15.105

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557

$15.105

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Parana Technologies

USA . 607 parts In-Stock

1+ parts

$23.091

100+ parts

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$23.732

10k+ parts

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607

$23.091

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$23.732

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DigiPath Technology Company

USA . 1,791 parts In-Stock

1+ parts

$25.426

100+ parts

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1,791

$25.426

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ChromeModa Solutions

Germany . 4,839 parts In-Stock

1+ parts

$25.945

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$21.275

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4,839

$25.945

$21.275

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IDEA Electronic Components Group

UK . 283 parts In-Stock

1+ parts

$25.945

100+ parts

$24.648

1k+ parts

$23.350

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283

$25.945

$24.648

$23.350

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Microchip USA

USA . 2,793 parts In-Stock

1+ parts

$47.334

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2,793

$47.334

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GreenTree Electronics

Israel . 9,970 parts In-Stock

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9,970

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iodParts Technologies Inc.

India . 9,000 parts In-Stock

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9,000

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Perfect Parts

USA . 560 parts In-Stock

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560

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A-Z Elektronik GmbH

Germany . 240 parts In-Stock

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Kepictronics

USA . 160 parts In-Stock

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160

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Futuretech Components

Singapore . 159 parts In-Stock

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159

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM365ZCE21 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM365ZCE21 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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