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TMS320DM6467CCUTV6

Texas Instruments

TMS320DM6467CCUTV6 by Texas Instruments

TMS320DM6467CCUTV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It has a package style of grid array and fine pitch, with a terminal finish of Sn/Ag/Cu. Ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

Median Price

$116.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 926 parts In-Stock

1+ parts

$113.074

100+ parts

$109.673

1k+ parts

$85.018

10k+ parts

-

926

$113.074

$109.673

$85.018

-

Rochester

USA . 168 parts In-Stock

1+ parts

$116.950

100+ parts

$109.930

1k+ parts

$102.920

10k+ parts

-

168

$116.950

$109.930

$102.920

-

DigiKey

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Verical

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$137.412

1k+ parts

$128.650

10k+ parts

-

168

-

$137.412

$128.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,914 parts In-Stock

1+ parts

$107.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,914

$107.420

-

-

-

DigiKey Marketplace

USA . 182 parts In-Stock

1+ parts

$122.810

100+ parts

-

1k+ parts

-

10k+ parts

-

182

$122.810

-

-

-

Vyrian

USA . 9,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,291

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 678 parts In-Stock

1+ parts

$35.172

100+ parts

-

1k+ parts

-

10k+ parts

-

678

$35.172

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$62.903

100+ parts

$57.242

1k+ parts

$51.580

10k+ parts

-

5,000

$62.903

$57.242

$51.580

-

Parana Technologies

USA . 47 parts In-Stock

1+ parts

$74.796

100+ parts

$6,945.989

1k+ parts

$67.317

10k+ parts

-

47

$74.796

$6,945.989

$67.317

-

DigiPath Technology Company

USA . 1,176 parts In-Stock

1+ parts

$82.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$82.360

-

-

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ChromeModa Solutions

Germany . 3,507 parts In-Stock

1+ parts

$84.041

100+ parts

$68.914

1k+ parts

-

10k+ parts

-

3,507

$84.041

$68.914

-

-

IDEA Electronic Components Group

UK . 335 parts In-Stock

1+ parts

$84.041

100+ parts

$79.839

1k+ parts

$75.637

10k+ parts

-

335

$84.041

$79.839

$75.637

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Corphita

USA . 2,766 parts In-Stock

1+ parts

$101.767

100+ parts

-

1k+ parts

-

10k+ parts

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2,766

$101.767

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-

-

Component Stockers USA

USA . 241 parts In-Stock

1+ parts

$120.600

100+ parts

$113.370

1k+ parts

-

10k+ parts

-

241

$120.600

$113.370

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-

Microchip USA

USA . 1,847 parts In-Stock

1+ parts

$138.730

100+ parts

$135.030

1k+ parts

$133.180

10k+ parts

$131.330

1,847

$138.730

$135.030

$133.180

$131.330

Overview

Experience the cutting-edge technology of the TMS320DM6467CCUTV6 by Texas Instruments, a top-of-the-line product in the category of Other Function uPs,uCs & Peripheral ICs. With a focus on quality and reliability, Texas Instruments brings you a versatile solution that offers unparalleled value and benefits. Unlock endless possibilities with this innovative product, whether you're looking to enhance your communications systems, control applications, or multimedia devices. Trust in Texas Instruments to deliver superior performance and efficiency, making your projects stand out from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for the product, ensuring long-term performance.

Surface Mount: YES

Surface mount technology allows for easier assembly and integration into various electronic devices.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and prevents damage to the product.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy placement on circuit boards.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities and performance for the product.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages allows for flexibility in different operating environments.

No. of Terminals: 529

The high number of terminals enables connectivity to various external components and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style facilitates high-density mounting and connection within electronic systems.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures stable operation and efficient power utilization for the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the product can function in cooler environments without issues.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish options of tin, silver, and copper provide corrosion resistance and ensure secure connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies board layout and allows for efficient heat dissipation.

Maximum Seated Height: 3.3 mm

A maximum seated height of 3.3 mm enables a compact design and easy integration in space-constrained applications.

RAM Words: 8192

With 8192 RAM words, the product can handle a large amount of data and execute tasks efficiently.

Width: 19 mm

The 19 mm width allows for easy placement on circuit boards and efficient use of space within electronic systems.

External Data Bus Width: 16

A 16-bit external data bus width enhances data transfer speeds and overall system performance.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures reliable soldering during the manufacturing process.

Length: 19 mm

The 19 mm length provides a balanced form factor for the product, making it suitable for various applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities and functionality for electronic devices.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed operation, making the product energy-efficient.

Terminal Form: BALL

Having ball terminals simplifies soldering processes and provides secure connections for the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable operation and compatibility with various power sources.

Bus Compatibility: I2C; PCI; SPI; UART; USB

Support for multiple bus interfaces such as I2C, PCI, SPI, UART, and USB enhances connectivity and compatibility with different devices.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for compact design and efficient signal routing within electronic systems.

Format: FIXED POINT

Operating in a fixed-point format provides accurate calculations and efficient data processing for the product.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the product can withstand moderate exposure to humidity during handling and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CCUTV6 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; PCI; SPI; UART; USB

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CCUTV6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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