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LM8330TMX/NOPB

Texas Instruments

LM8330TMX/NOPB by Texas Instruments

LM8330TMX/NOPB by Texas Instruments is a CMOS MICROPROCESSOR CIRCUIT with 128-bit Address Bus Width. It operates b/w -30 to 85 °C, with Supply Voltage ranging from 1.62V to 1.98V. Ideal for applications requiring low power consumption and compact design in electronics industry.

Median Price

$1.622

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 62,500 parts In-Stock

1+ parts

$1.622

100+ parts

$1.339

1k+ parts

$0.724

10k+ parts

-

62,500

$1.622

$1.339

$0.724

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$0.724

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$0.724

-

-

-

Digiode

USA . 2,771 parts In-Stock

1+ parts

$1.541

100+ parts

-

1k+ parts

-

10k+ parts

-

2,771

$1.541

-

-

-

Vyrian

USA . 7,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,178

-

-

-

-

Chip Stock

USA . 4,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,924 parts In-Stock

1+ parts

$0.724

100+ parts

-

1k+ parts

-

10k+ parts

$0.710

5,924

$0.724

-

-

$0.710

Argo Parts USA

USA . 2,717 parts In-Stock

1+ parts

$0.724

100+ parts

-

1k+ parts

-

10k+ parts

-

2,717

$0.724

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.724

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.724

-

-

-

Ampacity Inc.

Singapore . 62,344 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

62,344

$1.380

-

-

-

Corphita

USA . 1,495 parts In-Stock

1+ parts

$1.460

100+ parts

-

1k+ parts

-

10k+ parts

-

1,495

$1.460

-

-

-

AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$10.740

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$10.740

-

-

-

Parana Technologies

USA . 1,654 parts In-Stock

1+ parts

$48.225

100+ parts

$4,478.390

1k+ parts

$43.402

10k+ parts

-

1,654

$48.225

$4,478.390

$43.402

-

DigiPath Technology Company

USA . 483 parts In-Stock

1+ parts

$53.101

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$53.101

-

-

-

ChromeModa Solutions

Germany . 1,570 parts In-Stock

1+ parts

$54.185

100+ parts

$44.432

1k+ parts

-

10k+ parts

-

1,570

$54.185

$44.432

-

-

IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$54.185

100+ parts

$51.476

1k+ parts

$48.766

10k+ parts

-

942

$54.185

$51.476

$48.766

-

Corohmni

South Africa . 3,172 parts In-Stock

1+ parts

$85.127

100+ parts

-

1k+ parts

-

10k+ parts

-

3,172

$85.127

-

-

-

Overview

Enhance your electronic designs with the LM8330TMX/NOPB by Texas Instruments, a top-quality peripheral IC that offers unmatched reliability and performance. Manufactured by the trusted brand Texas Instruments, this innovative product is perfect for a wide range of applications in the realm of Other Function uPs,uCs & Peripheral ICs. With its advanced technology and precise engineering, the LM8330TMX/NOPB ensures optimal functionality while providing customers with exceptional value and benefits. Trust Texas Instruments to deliver excellence in every aspect of your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components, providing durability and protection for the product.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, saving time and cost.

Maximum Supply Voltage: 1.98 V

The higher maximum supply voltage allows for flexibility in power input.

Address Bus Width: 128

The wide address bus width enables efficient processing and handling of data.

Package Shape: SQUARE

The square shape provides easy handling and integration into circuit boards.

No. of Terminals: 25

Having a sufficient number of terminals allows for connectivity with other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers compactness and high density, ideal for space-constrained applications.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably in various environmental conditions.

Minimum Operating Temperature: -30 °C

The wide operating temperature range enables the product to function in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Having terminals on the bottom allows for easier mounting and soldering onto the circuit board.

No. of Ports: 20

With multiple ports available, the product can support various input/output connections.

Maximum Seated Height: 0.675 mm

The low seated height contributes to a slim profile, suitable for compact device designs.

Width: 2.01 mm

The narrow width enables efficient placement and arrangement of components on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time helps prevent overheating and ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the necessary soldering processes.

Length: 2.01 mm

The compact length contributes to a space-saving design and easy integration into electronic devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product can handle complex computational tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

Terminal Form: BALL

The ball terminal form provides reliable contact and connection during assembly and operation.

Maximum Supply Current: 0.03 mA

With a low maximum supply current, the product consumes minimal power during operation.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides stable power input for consistent performance.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density mounting and compact layout on the circuit board.

No. of I/O Lines: 20

Having a sufficient number of I/O lines enables the product to interface with external devices and peripherals effectively.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8330TMX/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Address Bus Width:

128

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.01 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

20

No. of Ports:

20

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Current:

.03 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.01 mm

Peripheral IC Type:

Trade Compliance

LM8330TMX/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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