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LM8322JGR8X/NOPB

Texas Instruments

LM8322JGR8X/NOPB by Texas Instruments

LM8322JGR8X/NOPB by Texas Instruments is a 36-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.62V to 1.98V. Suitable for industrial applications requiring thin profile and fine pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,417 parts In-Stock

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Digiode

USA . 1,423 parts In-Stock

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Anansix

USA . 961 parts In-Stock

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Corohmni

South Africa . 15 parts In-Stock

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$15.292

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15

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AZTECH Wire

Italy . 822 parts In-Stock

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$18.428

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One Stop Electronics

USA . 1,432 parts In-Stock

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$22.000

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Parana Technologies

USA . 2,087 parts In-Stock

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$27.579

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$37.574

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DigiPath Technology Company

USA . 153 parts In-Stock

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$30.368

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ChromeModa Solutions

Germany . 6,806 parts In-Stock

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$30.988

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$25.410

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

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$30.988

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$29.439

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$27.889

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Corphita

USA . 3,585 parts In-Stock

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Microchip USA

USA . 438 parts In-Stock

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Overview

Upgrade your electronics with the LM8322JGR8X/NOPB by Texas Instruments, a top-quality Peripheral IC that offers unparalleled performance and reliability. Manufactured by the industry leader, this versatile device is perfect for a wide range of applications. With a durable plastic package body and surface mount design, this product maximizes efficiency while minimizing space requirements. Experience the benefits of seamless integration and exceptional functionality with the LM8322JGR8X/NOPB - the ultimate solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and protects the internal components from external elements, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 1.98 V

The high maximum supply voltage capability ensures stable and reliable operation even under varying voltage conditions.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment during PCB assembly, ensuring proper connection and functionality.

No. of Terminals: 36

Having 36 terminals allows for multiple input and output connections, increasing the functionality and versatility of the product.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage requirement enables the product to operate efficiently even with lower power sources, saving energy and reducing costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function reliably in extreme cold environments, expanding its usability across various conditions.

Terminal Finish: TIN

Tin terminal finish enhances solderability and conductivity, ensuring secure connections and improving the overall performance of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and rework processes, making it easier to integrate the product onto PCBs with precision and accuracy.

Maximum Seated Height: 1.1 mm

The low maximum seated height minimizes the overall profile of the product, enabling compact designs and efficient use of space within electronic devices.

Width: 3.5 mm

The narrow width of 3.5 mm allows for a compact footprint, ideal for applications where space constraints are a concern.

Length: 3.5 mm

The short length of 3.5 mm further contributes to the compact design of the product, making it suitable for small electronic devices and applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making the product suitable for demanding applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enhances the product's processing capabilities, enabling advanced functions and performance in various electronic systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product in digital applications.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable contact points, ensuring stable operation and longevity of the product.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8 V ensures compatibility with standard power sources, making the product versatile and easy to integrate into various electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and precise connection points, contributing to the product's overall reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8322JGR8X/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

LM8322JGR8X/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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