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LM8333GGR8/NOPB

Texas Instruments

LM8333GGR8/NOPB by Texas Instruments

LM8333GGR8/NOPB by Texas Instruments is a 49-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2.25V to 2.9V and max current draw of 6mA. Ideal for industrial applications requiring low power consumption and compact design.

Median Price

$1.486

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.210

10k+ parts

$1.080

21,000

-

$1.460

$1.210

$1.080

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.512

10k+ parts

$1.350

21,000

-

-

$1.512

$1.350

Distributors (In-Stock)

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Digiode

USA . 3,540 parts In-Stock

1+ parts

$1.130

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3,540

$1.130

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Vyrian

USA . 4,499 parts In-Stock

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$1.190

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4,499

$1.190

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Anansix

USA . 1,343 parts In-Stock

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1,343

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Legend Electronics Inc.

USA . 957 parts In-Stock

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957

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Distributors (Availability)

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Corphita

USA . 827 parts In-Stock

1+ parts

$1.071

100+ parts

-

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827

$1.071

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Vigor

Singapore . 3,015 parts In-Stock

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$1.150

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3,015

$1.150

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Parana Technologies

USA . 731 parts In-Stock

1+ parts

$48.558

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731

$48.558

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DigiPath Technology Company

USA . 790 parts In-Stock

1+ parts

$53.468

100+ parts

$49.190

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790

$53.468

$49.190

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ChromeModa Solutions

Germany . 1,091 parts In-Stock

1+ parts

$54.559

100+ parts

$44.738

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1,091

$54.559

$44.738

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IDEA Electronic Components Group

UK . 958 parts In-Stock

1+ parts

$54.559

100+ parts

$51.831

1k+ parts

$49.103

10k+ parts

-

958

$54.559

$51.831

$49.103

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Corohmni

South Africa . 266 parts In-Stock

1+ parts

$77.110

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266

$77.110

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,234 parts In-Stock

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GreenTree Electronics

Israel . 2,453 parts In-Stock

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2,453

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Microchip USA

USA . 1,830 parts In-Stock

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Perfect Parts

USA . 1,262 parts In-Stock

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1,262

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Overview

Unleash the power of innovation with Texas Instruments' LM8333GGR8/NOPB, a cutting-edge microprocessor circuit designed for a wide range of applications. With a focus on quality and reliability, Texas Instruments delivers a product that exceeds industry standards. This versatile IC offers unparalleled value and benefits to customers, providing efficiency and performance in every use. Whether it's automation, control systems, or communication devices, the LM8333GGR8/NOPB is the perfect solution for your next project. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal and mechanical properties, making the product durable and reliable.

Surface Mount: YES

Enables easy and efficient installation onto a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 2.9 V

Allows for a higher operating voltage range, providing flexibility in power supply options.

Package Shape: SQUARE

Square packages are space-efficient and easier to align during assembly, improving overall design aesthetics.

Power Supplies (V): 2.5

Optimal power supply level that ensures stable performance without overload risks.

No. of Terminals: 49

Sufficient number of terminals for connecting various components and interfaces, enhancing functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This advanced package style offers high density, reduced footprint, and improved signal integrity for enhanced performance.

Minimum Supply Voltage: 2.25 V

Provides a lower limit for the operating voltage, ensuring proper functionality even under lower power conditions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold environments, making the product versatile and robust.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and efficient heat dissipation for improved thermal management.

Maximum Seated Height: 1.1 mm

Low profile design saves space and enables compact device construction.

Width: 4 mm

Compact width allows for integration into various electronic devices without taking up much space.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow processes during assembly for reliable connections.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures secure solder joints for long-term durability.

Length: 4 mm

Compact length for better integration and space-saving in electronic assemblies.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliable performance under varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminals allow for reliable connections and ease of soldering during assembly.

Maximum Supply Current: 6 mA

Low supply current consumption for energy-efficient operation and reduced overall power consumption.

Nominal Supply Voltage: 2.75 V

Optimal nominal supply voltage level for stable and efficient performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact design and high-density integration for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8333GGR8/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B49

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

2.9 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

LM8333GGR8/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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