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LM8322JGR8

Texas Instruments

LM8322JGR8 by Texas Instruments

LM8322JGR8 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.62V to 1.98V, making it ideal for INDUSTRIAL applications requiring low power consumption and compact design in a GRID ARRAY package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,498 parts In-Stock

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5,498

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Anansix

USA . 2,701 parts In-Stock

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2,701

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Digiode

USA . 2,102 parts In-Stock

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2,102

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$4.930

100+ parts

-

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449

$4.930

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Corohmni

South Africa . 338 parts In-Stock

1+ parts

$15.793

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338

$15.793

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Parana Technologies

USA . 399 parts In-Stock

1+ parts

$28.011

100+ parts

-

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$42.714

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399

$28.011

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$42.714

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DigiPath Technology Company

USA . 1,551 parts In-Stock

1+ parts

$30.844

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1,551

$30.844

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ChromeModa Solutions

Germany . 4,945 parts In-Stock

1+ parts

$31.473

100+ parts

$25.808

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4,945

$31.473

$25.808

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IDEA Electronic Components Group

UK . 1,329 parts In-Stock

1+ parts

$31.473

100+ parts

$29.899

1k+ parts

$28.326

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1,329

$31.473

$29.899

$28.326

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One Stop Electronics

USA . 629 parts In-Stock

1+ parts

$33.000

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629

$33.000

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Corphita

USA . 4,358 parts In-Stock

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4,358

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Overview

Elevate your next project with the LM8322JGR8 by Texas Instruments, a cutting-edge microprocessor circuit designed to deliver exceptional performance and reliability. With Texas Instruments' renowned reputation for quality and innovation, this peripheral IC offers unparalleled value and versatility in various applications. From automotive to industrial automation, this versatile device provides the perfect solution for your unique needs. Say goodbye to compromise and hello to superior technology with the LM8322JGR8.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.98 V

High maximum supply voltage allows for flexibility in power supply options, accommodating different voltage levels in the system.

Package Shape: SQUARE

Square package shape enables efficient use of space on the PCB, making it suitable for compact designs.

No. of Terminals: 36

A high number of terminals provide ample connectivity options for interfacing with other components, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch design enhances electrical performance and signal integrity, ideal for high-frequency applications.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage helps in reducing power consumption and improving efficiency, especially in battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in harsh industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows the product to function effectively in extreme cold conditions, offering versatility in different operating environments.

Temperature Grade: INDUSTRIAL

Industrial temperature grade designation indicates that the product is suitable for use in rugged industrial applications, ensuring robust performance under demanding conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type provides high processing power and functionality, making the product suitable for advanced computing and control applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product within the specified voltage range.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, saving space and enabling compact designs for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8322JGR8 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B36

Length:

3.5 mm

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

LM8322JGR8 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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