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LM8333GGR8X

Texas Instruments

LM8333GGR8X by Texas Instruments

LM8333GGR8X by Texas Instruments is a CMOS MICROPROCESSOR CIRCUIT with 49 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with supply voltage range of 2.25V to 2.75V. Ideal for industrial applications requiring thin profile and fine pitch components.

Median Price

$1.235

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$0.988

10k+ parts

$0.881

14,000

-

$1.190

$0.988

$0.881

DigiKey

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.490

10k+ parts

-

14,000

-

-

$1.490

-

Verical

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.235

10k+ parts

$1.101

14,000

-

-

$1.235

$1.101

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,085 parts In-Stock

1+ parts

$0.926

100+ parts

-

1k+ parts

-

10k+ parts

-

4,085

$0.926

-

-

-

Vyrian

USA . 3,970 parts In-Stock

1+ parts

$0.975

100+ parts

-

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-

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3,970

$0.975

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-

-

DigiKey Marketplace

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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14,000

-

-

-

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Anansix

USA . 2,094 parts In-Stock

1+ parts

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2,094

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,302 parts In-Stock

1+ parts

$0.878

100+ parts

-

1k+ parts

-

10k+ parts

-

2,302

$0.878

-

-

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Vigor

Singapore . 14,000 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

14,000

$0.940

-

-

-

Parana Technologies

USA . 1,312 parts In-Stock

1+ parts

$34.067

100+ parts

-

1k+ parts

$140.892

10k+ parts

-

1,312

$34.067

-

$140.892

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DigiPath Technology Company

USA . 494 parts In-Stock

1+ parts

$37.512

100+ parts

$34.511

1k+ parts

-

10k+ parts

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494

$37.512

$34.511

-

-

ChromeModa Solutions

Germany . 6,682 parts In-Stock

1+ parts

$38.278

100+ parts

$31.388

1k+ parts

-

10k+ parts

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6,682

$38.278

$31.388

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IDEA Electronic Components Group

UK . 354 parts In-Stock

1+ parts

$38.278

100+ parts

$36.364

1k+ parts

$34.450

10k+ parts

-

354

$38.278

$36.364

$34.450

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Corohmni

South Africa . 1,209 parts In-Stock

1+ parts

$42.183

100+ parts

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1,209

$42.183

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Alle Elektronik GmbH

Germany . 4,428 parts In-Stock

1+ parts

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4,428

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Assy Fe

Spain . 3,485 parts In-Stock

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3,485

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Overview

Elevate your electronic devices with the LM8333GGR8X from Texas Instruments, a cutting-edge microprocessor circuit designed to enhance performance and efficiency. Crafted with precision and innovation, this peripheral IC boasts a square package body material that ensures durability and reliability. Whether you're looking to optimize power management or streamline data processing, the LM8333GGR8X offers unparalleled value and benefits. Trust Texas Instruments for top-tier quality and superior technology in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to external factors, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic systems, saving time and effort during assembly.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75V ensures efficient power consumption and prevents damage to the components.

Package Shape: SQUARE

Square package shape offers uniform distribution of components and efficient use of space in electronic systems.

No. of Terminals: 49

Having 49 terminals allows for versatile connectivity options and compatibility with a wide range of devices and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch design enables high-density mounting and efficient signal routing for improved performance.

Minimum Supply Voltage: 2.25 V

With a minimum supply voltage of 2.25V, the product can operate efficiently and reliably even under low power conditions.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures stable performance in various operating conditions and environments.

Minimum Operating Temperature: -40 °C

Capable of operating at a minimum temperature of -40°C, making it suitable for use in extreme cold environments without performance degradation.

Terminal Position: BOTTOM

Bottom terminal position allows for optimal PCB layout and efficient heat dissipation, contributing to overall system reliability.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1mm, the product offers a compact and low-profile design for space-constrained applications.

Width: 4 mm

A width of 4mm provides a compact form factor, allowing for easy integration into electronic systems with limited space.

Length: 4 mm

Having a length of 4mm ensures a square form factor, contributing to a uniform and efficient design layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable operation in harsh industrial environments, making it suitable for a wide range of applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type, the product offers advanced processing capabilities and enhanced functionality for diverse applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, contributing to efficient and reliable operation.

Terminal Form: BALL

Ball terminal form enables easy soldering and reliable electrical connections, ensuring robust performance and durability.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for high-density mounting and precise alignment of terminals, enhancing overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8333GGR8X attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B49

Length:

4 mm

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4 mm

Peripheral IC Type:

Trade Compliance

LM8333GGR8X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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