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LM8323JGR8AXMX/NOPB

Texas Instruments

LM8323JGR8AXMX/NOPB by Texas Instruments

LM8323JGR8AXMX/NOPB by Texas Instruments is a 36-terminal IC with a supply voltage range of 1.62V to 1.98V, suitable for industrial applications. It features I2C bus compatibility, CMOS technology, and operates b/w -40°C to 85°C. The package style is grid array with thin profile and fine pitch, making it ideal for microprocessor circuits in compact designs.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,000 parts In-Stock

1+ parts

$2.872

100+ parts

$2.372

1k+ parts

$1.282

10k+ parts

-

17,000

$2.872

$2.372

$1.282

-

Rochester

USA . 276,500 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.490

276,500

-

$2.950

$2.640

$2.490

Verical

USA . 276,500 parts In-Stock

1+ parts

-

100+ parts

$3.888

1k+ parts

$3.300

10k+ parts

$3.112

276,500

-

$3.888

$3.300

$3.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,420 parts In-Stock

1+ parts

$1.691

100+ parts

-

1k+ parts

-

10k+ parts

-

1,420

$1.691

-

-

-

Vyrian

USA . 2,278 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

2,278

$1.780

-

-

-

Anansix

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,710 parts In-Stock

1+ parts

$1.521

100+ parts

-

1k+ parts

-

10k+ parts

-

2,710

$1.521

-

-

-

Corphita

USA . 1,018 parts In-Stock

1+ parts

$1.602

100+ parts

-

1k+ parts

-

10k+ parts

-

1,018

$1.602

-

-

-

Parana Technologies

USA . 683 parts In-Stock

1+ parts

$60.679

100+ parts

$5,634.994

1k+ parts

$54.611

10k+ parts

-

683

$60.679

$5,634.994

$54.611

-

DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$66.815

100+ parts

$61.470

1k+ parts

-

10k+ parts

-

1,910

$66.815

$61.470

-

-

IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$68.179

100+ parts

$64.770

1k+ parts

$61.361

10k+ parts

-

445

$68.179

$64.770

$61.361

-

ChromeModa Solutions

Germany . 255 parts In-Stock

1+ parts

$68.179

100+ parts

$55.907

1k+ parts

-

10k+ parts

-

255

$68.179

$55.907

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Upgrade your electronic devices with the LM8323JGR8AXMX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. This versatile Other Function uPs,uCs & Peripheral IC is perfect for a wide range of applications, providing efficient power management and seamless integration. With a compact design and advanced technology, this product offers customers unmatched value and benefits. Experience innovation at its finest with the LM8323JGR8AXMX/NOPB from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package is durable and cost-effective, making this product a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly processes, reducing production time and costs.

Maximum Supply Voltage: 1.98 V

High maximum supply voltage provides flexibility in power requirements for different designs and applications.

Package Shape: SQUARE

Square package shape helps in efficient use of PCB space and facilitates easier alignment during assembly.

Power Supplies (V): 1.8

Stable power supply voltage of 1.8V ensures consistent performance of the product in various operating conditions.

No. of Terminals: 36

Having 36 terminals allows for multiple connections and interfaces, enabling versatile functionality in a compact form factor.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch package style offers high density integration, optimal signal routing, and reliable connections.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C enables the product to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40°C makes this product suitable for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper provides excellent electrical conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position ensures easy and secure soldering connections, enhancing the overall reliability of the product.

Maximum Seated Height: 1.1 mm

Low maximum seated height saves space on the PCB and allows for more compact designs in space-constrained applications.

Width: 3.5 mm

Compact width of 3.5mm contributes to the overall small form factor of the product, suitable for size-sensitive designs.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and bonding of the product to the PCB for secure connections.

Length: 3.5 mm

Compact length of 3.5mm allows for space-efficient placement on the PCB, maximizing board real estate for other components.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating environments, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC offers advanced processing capabilities and enhances the product's functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form enables easy and reliable connections during soldering, ensuring a secure attachment to the PCB.

Maximum Supply Current: 3 mA

Low maximum supply current of 3mA helps in reducing power consumption and heat generation, prolonging the product's lifespan.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage of 1.9V ensures consistent performance and compatibility with various power sources.

Bus Compatibility: I2C

Support for I2C bus compatibility allows for easy integration with other I2C devices, enabling seamless communication and control.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm enables high-density mounting and compact PCB designs, ideal for miniaturized electronic devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8323JGR8AXMX/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e1

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

LM8323JGR8AXMX/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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