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LM8333FLQ8Y

Texas Instruments

LM8333FLQ8Y by Texas Instruments

LM8333FLQ8Y by Texas Instruments is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with supply voltage range of 2.25V to 2.75V. Ideal for industrial applications requiring low power consumption and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,336 parts In-Stock

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Digiode

USA . 4,884 parts In-Stock

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Anansix

USA . 2,463 parts In-Stock

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AZTECH Wire

Italy . 730 parts In-Stock

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$12.464

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One Stop Electronics

USA . 1,595 parts In-Stock

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Corohmni

South Africa . 681 parts In-Stock

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Parana Technologies

USA . 367 parts In-Stock

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$39.269

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DigiPath Technology Company

USA . 899 parts In-Stock

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$43.241

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$39.781

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ChromeModa Solutions

Germany . 6,534 parts In-Stock

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$44.123

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$36.181

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IDEA Electronic Components Group

UK . 1,680 parts In-Stock

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$41.917

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$39.711

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 4,238 parts In-Stock

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Corphita

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Assy Fe

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Perfect Parts

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Overview

Discover the LM8333FLQ8Y by Texas Instruments, a top-quality Peripheral IC that guarantees exceptional performance and reliability. With Texas Instruments' renowned reputation for innovation and cutting-edge technology, this product is sure to exceed your expectations. Perfect for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category, this chip carrier with heat sink/slug package style offers incredible value and benefits. Experience the advantages of the LM8333FLQ8Y, from its industrial-grade temperature tolerance to its innovative CMOS technology. Trust Texas Instruments for all your microprocessor circuit needs. Unlock new possibilities with the LM8333FLQ8Y today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75 V, this product is suitable for low power applications, helping to extend battery life and reduce power consumption.

Package Shape: SQUARE

The square package shape provides a compact and efficient form factor, making it ideal for space-constrained applications.

No. of Terminals: 32

With 32 terminals, this product offers a sufficient number of connection points for versatile integration and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in a variety of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8333FLQ8Y attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Trade Compliance

LM8333FLQ8Y Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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