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LM8333GGR8AXS/NOPB

Texas Instruments

LM8333GGR8AXS/NOPB by Texas Instruments

LM8333GGR8AXS/NOPB by Texas Instruments is a 49-terminal IC with 2.5V power supply, suitable for industrial applications. It operates b/w -40 to 85°C, supports I2C bus compatibility, and has a max clock frequency of 0.4MHz. Ideal for microprocessor circuits requiring low power consumption and compact design in a thin profile grid array package.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

1,000

-

$1.750

$1.560

$1.470

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.300

10k+ parts

-

1,000

-

-

$2.300

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.837

1,000

-

-

$1.950

$1.837

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,386 parts In-Stock

1+ parts

$1.786

100+ parts

-

1k+ parts

-

10k+ parts

-

3,386

$1.786

-

-

-

Vyrian

USA . 3,498 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,498

$1.880

-

-

-

Anansix

USA . 1,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,416

-

-

-

-

DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,000 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.330

-

-

-

Corphita

USA . 1,742 parts In-Stock

1+ parts

$1.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,742

$1.692

-

-

-

Corohmni

South Africa . 829 parts In-Stock

1+ parts

$28.985

100+ parts

-

1k+ parts

-

10k+ parts

-

829

$28.985

-

-

-

Parana Technologies

USA . 305 parts In-Stock

1+ parts

$56.320

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$56.320

-

-

-

DigiPath Technology Company

USA . 1,887 parts In-Stock

1+ parts

$62.015

100+ parts

-

1k+ parts

-

10k+ parts

-

1,887

$62.015

-

-

-

IDEA Electronic Components Group

UK . 2,184 parts In-Stock

1+ parts

$63.281

100+ parts

$60.117

1k+ parts

$56.953

10k+ parts

-

2,184

$63.281

$60.117

$56.953

-

ChromeModa Solutions

Germany . 466 parts In-Stock

1+ parts

$63.281

100+ parts

$51.890

1k+ parts

-

10k+ parts

-

466

$63.281

$51.890

-

-

Perfect Parts

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,360

-

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock the power of innovation with the LM8333GGR8AXS/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a top-quality product that offers unmatched reliability and performance. This versatile IC is perfect for a wide range of applications, making it a must-have for any project requiring precision and efficiency. With its advanced technology and superior design, the LM8333GGR8AXS/NOPB delivers exceptional value and benefits to customers, ensuring seamless integration and optimal functionality. Elevate your projects to new heights with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the integrated circuits inside, making it suitable for various environments.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on PCBs, saving time and effort in assembly processes.

Maximum Supply Voltage: 2.9 V

Higher maximum supply voltage allows for flexibility in power sources, accommodating a wider range of applications.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving space on the PCB and allowing for more efficient layout designs.

Power Supplies (V): 2.5

Stable power supply at 2.5V ensures reliable operation of the integrated circuits, reducing the risk of malfunctions or failures.

No. of Terminals: 49

Higher number of terminals allows for more connectivity options and configurations, enabling versatile use in different systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures stable performance in various environmental conditions, including industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance of -40°C allows for reliable operation even in extreme cold conditions, expanding the product's usability range.

Terminal Finish: TIN SILVER COPPER

Tin silver copper finish on terminals provides good conductivity and corrosion resistance, ensuring reliable connections and longevity.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the product into various electronic systems.

Maximum Seated Height: 1.1 mm

Low maximum seated height allows for a slim profile, contributing to space-saving designs and facilitating compact electronic devices.

Width: 4 mm

Narrow width of 4mm enables efficient placement of the product on the PCB, optimizing space utilization and overall layout design.

Maximum Clock Frequency: 0.4 MHz

Moderate maximum clock frequency of 0.4 MHz suits applications that require reliable timing and synchronization, providing stable performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product's reliability in demanding operational conditions, making it suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated microprocessor circuit enhances the product's functionality and processing capabilities, enabling complex operations and tasks to be performed efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides secure connections and simplifies soldering processes, ensuring reliable electrical contacts and ease of assembly.

Bus Compatibility: I2C

I2C bus compatibility allows for easy communication with other devices, facilitating seamless integration into a wide range of systems and configurations.

No. of I/O Lines: 4

Sufficient number of I/O lines enables versatile input/output configurations, allowing for diverse applications and connectivity options.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8333GGR8AXS/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Address Bus Width:

1

Bus Compatibility:

I2C

Maximum Clock Frequency:

.4 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

4

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

2.9 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

LM8333GGR8AXS/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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