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LM8323JGR8AXM/NOPB

Texas Instruments

LM8323JGR8AXM/NOPB by Texas Instruments

LM8323JGR8AXM/NOPB by Texas Instruments is a 36-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates at -40 to 85 °C, with supply voltage range of 1.62V to 1.98V. Suitable for industrial applications requiring I2C bus compatibility in a compact GRID ARRAY package.

Median Price

$3.380

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,500 parts In-Stock

1+ parts

$3.107

100+ parts

$2.722

1k+ parts

$1.538

10k+ parts

-

9,500

$3.107

$2.722

$1.538

-

Rochester

USA . 11,950 parts In-Stock

1+ parts

-

100+ parts

$3.380

1k+ parts

$3.030

10k+ parts

$2.850

11,950

-

$3.380

$3.030

$2.850

Verical

USA . 11,950 parts In-Stock

1+ parts

-

100+ parts

$4.225

1k+ parts

$3.788

10k+ parts

$3.563

11,950

-

$4.225

$3.788

$3.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,489 parts In-Stock

1+ parts

$2.033

100+ parts

-

1k+ parts

-

10k+ parts

-

3,489

$2.033

-

-

-

Vyrian

USA . 1,059 parts In-Stock

1+ parts

$2.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,059

$2.140

-

-

-

Anansix

USA . 617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

617

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 540 parts In-Stock

1+ parts

$1.630

100+ parts

-

1k+ parts

-

10k+ parts

-

540

$1.630

-

-

-

Corphita

USA . 5,287 parts In-Stock

1+ parts

$1.926

100+ parts

-

1k+ parts

-

10k+ parts

-

5,287

$1.926

-

-

-

Component Stockers USA

USA . 14,543 parts In-Stock

1+ parts

$2.190

100+ parts

$2.070

1k+ parts

$1.660

10k+ parts

$1.870

14,543

$2.190

$2.070

$1.660

$1.870

Parana Technologies

USA . 857 parts In-Stock

1+ parts

$74.432

100+ parts

$6,912.185

1k+ parts

$66.989

10k+ parts

-

857

$74.432

$6,912.185

$66.989

-

DigiPath Technology Company

USA . 1,798 parts In-Stock

1+ parts

$81.959

100+ parts

$75.403

1k+ parts

-

10k+ parts

-

1,798

$81.959

$75.403

-

-

IDEA Electronic Components Group

UK . 51 parts In-Stock

1+ parts

$83.632

100+ parts

$79.450

1k+ parts

$75.269

10k+ parts

-

51

$83.632

$79.450

$75.269

-

ChromeModa Solutions

Germany . 36 parts In-Stock

1+ parts

$83.632

100+ parts

$68.578

1k+ parts

-

10k+ parts

-

36

$83.632

$68.578

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Discover the LM8323JGR8AXM/NOPB by Texas Instruments, a high-quality microprocessor circuit designed for various applications. With advanced CMOS technology and industrial-grade temperature tolerance, this peripheral IC offers unmatched reliability and performance. From thin profile grid arrays to fine pitch terminals, this product delivers seamless integration and superior functionality. Trust in Texas Instruments' reputation for excellence and elevate your projects with the LM8323JGR8AXM/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology provides ease of installation and space-saving benefits.

Maximum Supply Voltage: 1.98 V

Allows for a wide range of input voltages, increasing flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easier placement in compact designs.

Power Supplies (V): 1.8

Low power supply requirement helps in reducing energy consumption and heat generation.

No. of Terminals: 36

Sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch design allow for high-density mounting and improved signal integrity.

Minimum Supply Voltage: 1.62 V

Wide range of supply voltage tolerance ensures stable operation under varying conditions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB.

Maximum Seated Height: 1.1 mm

Low seated height allows for slim and compact device designs.

Width: 3.5 mm

Narrow width enables placement in tight spaces and compact PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and component bonding.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable solder joints and component integrity.

Length: 3.5 mm

Compact length for space-saving designs and efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade for enhanced reliability in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit for advanced processing capabilities and versatile application support.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form for reliable connections and ease of surface mounting.

Maximum Supply Current: 3 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage for consistent performance and operation.

Bus Compatibility: I2C

I2C bus compatibility for easy integration with other devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and efficient PCB layout.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8323JGR8AXM/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e1

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

LM8323JGR8AXM/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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