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LM8333GGR8

Texas Instruments

LM8333GGR8 by Texas Instruments

LM8333GGR8 by Texas Instruments is a 49-terminal IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2.25-2.75 V. Ideal for industrial applications requiring microprocessor circuits in a compact square package.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,755 parts In-Stock

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Digiode

USA . 4,689 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 999 parts In-Stock

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Bristol Electronics

USA . 999 parts In-Stock

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$1.313

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$0.735

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999

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$1.313

$0.735

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Dan-Mar Components

USA . 999 parts In-Stock

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999

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Anansix

USA . 946 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,171 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 751 parts In-Stock

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$12.576

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Corohmni

South Africa . 2,073 parts In-Stock

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$15.517

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Parana Technologies

USA . 213 parts In-Stock

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$75.212

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DigiPath Technology Company

USA . 1,620 parts In-Stock

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$82.818

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ChromeModa Solutions

Germany . 4,913 parts In-Stock

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$84.508

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$69.297

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

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$84.508

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$80.283

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$76.057

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Alle Elektronik GmbH

Germany . 3,123 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 804 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the LM8333GGR8 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. The LM8333GGR8 offers exceptional value, providing customers with unmatched benefits and advantages. Boost efficiency and functionality in your projects with this top-of-the-line peripheral IC, designed to meet industrial-grade standards. Upgrade your technology with Texas Instruments and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to external elements, making this product suitable for a variety of environments.

Surface Mount: YES

Surface mount feature allows for easy installation on PCBs, saving time and effort during assembly process.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this product offers efficient power management and helps in preventing damage due to overvoltage.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB and ensures a neat and compact design layout.

No. of Terminals: 49

Having 49 terminals allows for multiple connections and options for peripheral devices, making this product versatile and adaptable for various applications.

Maximum Seated Height: 1.1 mm

Low seated height of 1.1mm enables compact and slim design integration, ideal for devices with space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range (-40°C to 85°C), ensuring reliable performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enhances the processing capabilities of the product, enabling complex functions and efficient operations.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making this product energy-efficient and versatile.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high density integration on the PCB, maximizing functionality within a limited space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LM8333GGR8 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B49

Length:

4 mm

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4 mm

Peripheral IC Type:

Trade Compliance

LM8333GGR8 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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