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OMAPL132BZWT2

Texas Instruments

OMAPL132BZWT2 by Texas Instruments

OMAPL132BZWT2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low-power applications. With a compact size of 16mm x 16mm and surface-mount capability, it is ideal for space-constrained designs in various electronic devices.

Median Price

$17.413

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 660 parts In-Stock

1+ parts

-

100+ parts

$13.930

1k+ parts

$12.460

10k+ parts

$11.730

660

-

$13.930

$12.460

$11.730

DigiKey

USA . 660 parts In-Stock

1+ parts

-

100+ parts

$18.330

1k+ parts

-

10k+ parts

-

660

-

$18.330

-

-

Verical

USA . 362 parts In-Stock

1+ parts

-

100+ parts

$17.413

1k+ parts

$15.575

10k+ parts

$14.662

362

-

$17.413

$15.575

$14.662

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,599 parts In-Stock

1+ parts

$14.696

100+ parts

-

1k+ parts

-

10k+ parts

-

1,599

$14.696

-

-

-

Vyrian

USA . 4,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,090

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,097 parts In-Stock

1+ parts

$13.923

100+ parts

-

1k+ parts

-

10k+ parts

-

2,097

$13.923

-

-

-

Corohmni

South Africa . 1,025 parts In-Stock

1+ parts

$33.015

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$33.015

-

-

-

Parana Technologies

USA . 1,694 parts In-Stock

1+ parts

$39.456

100+ parts

$3,664.122

1k+ parts

$35.511

10k+ parts

-

1,694

$39.456

$3,664.122

$35.511

-

DigiPath Technology Company

USA . 1,948 parts In-Stock

1+ parts

$43.446

100+ parts

$39.971

1k+ parts

-

10k+ parts

-

1,948

$43.446

$39.971

-

-

ChromeModa Solutions

Germany . 6,917 parts In-Stock

1+ parts

$44.333

100+ parts

$36.353

1k+ parts

-

10k+ parts

-

6,917

$44.333

$36.353

-

-

IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$44.333

100+ parts

$42.116

1k+ parts

$39.900

10k+ parts

-

1,067

$44.333

$42.116

$39.900

-

Perfect Parts

USA . 12,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,320

-

-

-

-

Microchip USA

USA . 195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

195

-

-

-

-

Overview

Enhance your electronic designs with the OMAPL132BZWT2 from Texas Instruments, a leading manufacturer known for its superior quality and reliability. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications for various projects. With its innovative features and advanced technology, this device provides unmatched value and benefits to customers. Trust in Texas Instruments to deliver cutting-edge solutions that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.05 V

Operates at a relatively low maximum supply voltage, which can help in reducing power consumption.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the circuit board.

Power Supplies (V): 1.2,1.8/3.3

Offers flexibility in power supply options, enabling compatibility with a range of systems.

No. of Terminals: 361

Large number of terminals allow for connectivity with multiple components, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array design with low profile and fine pitch improves signal integrity and thermal performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement enhances efficiency and can prolong battery life in portable devices.

Terminal Finish: TIN SILVER COPPER

Tin silver copper finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and ensures secure soldering.

Maximum Seated Height: 1.4 mm

Low seated height allows for slim and compact device design.

Width: 16 mm

Compact width dimension contributes to space-saving design on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient solder reflow process within a short time frame.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during the soldering process.

Length: 16 mm

Short length dimension contributes to a compact and space-saving device layout.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates a microprocessor circuit for advanced processing capabilities and versatility in applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form enables reliable connections and simplifies the soldering process.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and compatibility with various systems.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and contributes to a compact design.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain product quality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132BZWT2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132BZWT2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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