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TMS320DM6467CCUTD7

Texas Instruments

TMS320DM6467CCUTD7 by Texas Instruments

TMS320DM6467CCUTD7 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at -40 to 85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. Ideal for industrial applications requiring a CMOS technology-based microprocessor circuit in a compact square package.

Median Price

$121.280

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,757 parts In-Stock

1+ parts

$104.698

100+ parts

$101.549

1k+ parts

$78.720

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1,757

$104.698

$101.549

$78.720

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Rochester

USA . 42 parts In-Stock

1+ parts

$121.280

100+ parts

$114.000

1k+ parts

$106.730

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42

$121.280

$114.000

$106.730

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DigiKey

USA . 42 parts In-Stock

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42

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Verical

USA . 41 parts In-Stock

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$147.050

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41

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$147.050

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Distributors (In-Stock)

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Digiode

USA . 2,326 parts In-Stock

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$99.463

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2,326

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Vyrian

USA . 7,471 parts In-Stock

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7,471

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TME

Poland . 168 parts In-Stock

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$130.210

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168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 882 parts In-Stock

1+ parts

$38.066

100+ parts

$3,535.023

1k+ parts

$34.260

10k+ parts

-

882

$38.066

$3,535.023

$34.260

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DigiPath Technology Company

USA . 1,585 parts In-Stock

1+ parts

$41.916

100+ parts

$38.562

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-

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1,585

$41.916

$38.562

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ChromeModa Solutions

Germany . 1,736 parts In-Stock

1+ parts

$42.771

100+ parts

$35.072

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1,736

$42.771

$35.072

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IDEA Electronic Components Group

UK . 1,467 parts In-Stock

1+ parts

$42.771

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$40.632

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$38.494

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1,467

$42.771

$40.632

$38.494

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Corohmni

South Africa . 1,226 parts In-Stock

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$70.005

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$70.005

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Ampacity Inc.

Singapore . 463 parts In-Stock

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$88.990

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463

$88.990

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Corphita

USA . 312 parts In-Stock

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$94.228

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312

$94.228

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Microchip USA

USA . 377 parts In-Stock

1+ parts

$395.900

100+ parts

$388.700

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$388.700

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$381.500

377

$395.900

$388.700

$388.700

$381.500

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 953 parts In-Stock

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953

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Perfect Parts

USA . 112 parts In-Stock

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Futuretech Components

Singapore . 111 parts In-Stock

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Overview

Experience cutting-edge technology with the TMS320DM6467CCUTD7 by Texas Instruments. As a leading manufacturer in the industry, this product offers unparalleled quality and reliability. Ideal for a wide range of applications in the realm of microprocessor circuits, this device delivers exceptional performance and efficiency. With features like a 32-bit architecture, multiple power supply options, and a compact square package design, the TMS320DM6467CCUTD7 is a game-changer in the world of uPs and uCs. Stay ahead of the curve and unlock endless possibilities with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and thermal properties, making the product reliable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving design, making the product suitable for compact electronic devices.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures safe operation and protection of the integrated circuits within the specified limit.

Package Shape: SQUARE

The square package shape provides a uniform and compact form factor, enabling easy integration into electronic systems.

Bit Size: 32

The 32-bit size allows for high-speed processing and efficient data handling, making the product suitable for demanding applications.

Power Supplies (V): 1.2, 1.8, 3.3

The availability of multiple power supply options provides flexibility in designing and operating the product in different voltage environments.

No. of Terminals: 529

The high number of terminals allows for a wide range of connectivity options and interfaces, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting and reliable connections, optimizing overall performance.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures efficient power consumption and extends the product's operating range.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand elevated temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in cold climates or extreme conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish with tin, silver, and copper materials provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure soldering, enhancing the product's overall durability and connection stability.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3mm allows for compact and low-profile designs, suitable for space-constrained applications.

RAM Words: 8192

The ample amount of RAM words (8192) provides sufficient memory for data storage and processing, accommodating complex tasks effectively.

Width: 19 mm

The width of 19mm offers a balanced form factor, allowing for easy integration and assembly with other electronic components.

External Data Bus Width: 16

With a wide external data bus width of 16 bits, the product can handle large volumes of data efficiently, enhancing performance.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures secure soldering connections and reliable performance during assembly processes.

Length: 19 mm

The length of 19mm contributes to a compact and uniform package size, optimizing space utilization in electronic designs.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the product's reliability and stability in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities and functionality for diverse applications.

Technology: CMOS

The CMOS technology used in the product enables low power consumption, high speed, and reliable operation, making it ideal for efficient electronic systems.

Terminal Form: BALL

The ball terminal form offers secure connections and high conductivity, ensuring stable electrical performance and signal integrity.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V provides a standard operating voltage for efficient power management and compatibility with various systems.

Bus Compatibility: I2C; PCI; SPI; UART; USB

The bus compatibility with I2C, PCI, SPI, UART, and USB interfaces allows for versatile connectivity and communication options in different applications.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm enables high-density packaging and precise connections, enhancing the product's performance and reliability.

Format: FIXED POINT

The fixed-point format simplifies arithmetic calculations and improves processing efficiency, making the product suitable for specific computation tasks.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the product has a low sensitivity to moisture, ensuring reliability and stability during storage and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CCUTD7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

I2C; PCI; SPI; UART; USB

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CCUTD7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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