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TDA8026ET/C2,518

NXP Semiconductors

TDA8026ET/C2,518 by NXP Semiconductors

TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 542 parts In-Stock

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Vyrian

USA . 6,785 parts In-Stock

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Anansix

USA . 1,192 parts In-Stock

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Digiode

USA . 346 parts In-Stock

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346

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Corohmni

South Africa . 121 parts In-Stock

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$4.000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,198 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,013 parts In-Stock

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Corphita

USA . 1,953 parts In-Stock

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UNI Independent Distributors

Spain . 1,743 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Overview

Unlock the power of innovation with the TDA8026ET/C2,518 from NXP Semiconductors! Designed for exceptional performance in a compact package, this versatile microprocessor circuit excels across diverse applications, ensuring reliability and efficiency. With NXP's commitment to quality and cutting-edge technology, you’ll benefit from enhanced functionality and durability that drive your projects forward. Elevate your designs with a trusted partner in semiconductor excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a lightweight and durable enclosure, enhancing the reliability and longevity of the microprocessor circuit.

Surface Mount: YES

Surface mount technology allows for a more compact design and increased manufacturing efficiency, making this component suitable for modern electronics.

Package Shape: SQUARE

A square shape optimizes space utilization on PCBs, making it easier to integrate multiple components in tight layouts.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V is beneficial for power efficiency, reducing energy costs and allowing for longer battery life in portable devices.

No. of Terminals: 64

With 64 terminals, this microprocessor circuit offers extensive connectivity options for various peripherals and systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style allows for high-density connections, essential for advanced electronics with increased functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for use in a variety of environments, enhancing its versatility.

Minimum Operating Temperature: -25 °C

A wide temperature range ensures reliable performance in cold environments, making this microprocessor suitable for diverse applications.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish ensures excellent solderability and provides protection against corrosion, promoting durability and reliability.

Terminal Position: BOTTOM

Bottom terminal positioning aids in optimized space-saving on PCBs while facilitating effective thermal management.

Maximum Time At Peak Reflow Temperature: 30s

A peak reflow time of 30 seconds helps ensure effective solder joint formation, contributing to the overall reliability of the assembly.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C allows compatibility with various soldering processes, ensuring versatility in manufacturing.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Designed as a microprocessor circuit, this product delivers high processing power, making it ideal for complex computing tasks.

Terminal Form: BALL

Ball terminal form design enhances electrical performance and thermal management, allowing for effective heat dissipation in the device.

Maximum Supply Current: 260 mA

With a maximum supply current of 260 mA, this microprocessor circuit can handle demanding tasks while remaining power-efficient.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V supports low-power consumption, making this product suitable for battery-operated devices.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm enables high-density PCB designs, facilitating the integration of more components within a minimal footprint.

Moisture Sensitivity Level (MSL): 2

An MSL of 2 indicates moderate moisture sensitivity, allowing for appropriate handling and storage practices to ensure product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8026ET/C2,518 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

260 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TDA8026ET/C2,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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