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TDA8002AT/5/C1

NXP Semiconductors

TDA8002AT/5/C1 by NXP Semiconductors

TDA8002AT/5/C1 by NXP is a CMOS microprocessor circuit in a compact 28-terminal SO package. It operates at a max supply voltage of 6.5V and temp range of -25 °C to 85 °C, ideal for various embedded applications requiring efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,454 parts In-Stock

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4,454

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Digiode

USA . 2,855 parts In-Stock

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2,855

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Anansix

USA . 751 parts In-Stock

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751

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One Stop Electronics

USA . 471 parts In-Stock

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$5.000

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471

$5.000

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Corohmni

South Africa . 134 parts In-Stock

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$40.672

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134

$40.672

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UNI Independent Distributors

Spain . 1,647 parts In-Stock

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Corphita

USA . 160 parts In-Stock

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Overview

Unlock the potential of your projects with the TDA8002AT/5/C1 from NXP Semiconductors, where quality meets innovation. This versatile microprocessor circuit offers reliable performance across a range of applications, from consumer electronics to industrial controls. With its compact design, it’s engineered for efficiency and adaptability, ensuring you get unmatched value and performance. Elevate your designs and experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mounting allows for efficient use of space on PCBs, facilitating high-density circuit designs.

Maximum Supply Voltage: 6.5 V

A maximum supply voltage of 6.5 V ensures compatibility with a wide range of power supply systems.

Package Shape: RECTANGULAR

The rectangular shape aids in easier layout design and efficient usage of PCB space.

No. of Terminals: 28

With 28 terminals, this product provides ample connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact designs, making it an ideal choice for space-constrained applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature allows the product to function reliably in demanding environments.

Minimum Operating Temperature: -25 °C

This wide temperature range ensures that the product can operate effectively in various climatic conditions.

Terminal Position: DUAL

Dual terminal positioning enhances the flexibility of PCB layout and design.

Maximum Seated Height: 2.65 mm

A low maximum seated height allows for a more compact design and fits into tighter spaces.

Width: 7.5 mm

The compact width contributes to overall smaller device footprints, making it suitable for portable applications.

Length: 17.9 mm

A manageable length supports easy integration into various circuit designs without compromising space.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it provides robust processing capabilities, making it suitable for advanced applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, enhancing overall efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly, improving manufacturing efficiency.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA helps in energy-efficient designs, further extending battery life in portable applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes it compatible with most common electronic systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides versatility in PCB design, allowing for easier routing and layout.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8002AT/5/C1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

6.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

TDA8002AT/5/C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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