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TDA8002BT/5/C1

NXP Semiconductors

TDA8002BT/5/C1 by NXP Semiconductors

TDA8002BT/5/C1 by NXP Semiconductors is a CMOS microprocessor circuit with a max supply voltage of 6.5V and operates b/w -25 °C to 85 °C. It features a compact 28-terminal design in a small outline package. Ideal for various peripheral applications, it ensures efficient performance in limited spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,137 parts In-Stock

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2,137

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Vyrian

USA . 1,911 parts In-Stock

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Anansix

USA . 693 parts In-Stock

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693

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One Stop Electronics

USA . 310 parts In-Stock

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$7.000

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310

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Corohmni

South Africa . 560 parts In-Stock

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$36.754

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560

$36.754

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UNI Independent Distributors

Spain . 7,038 parts In-Stock

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Corphita

USA . 4,492 parts In-Stock

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Overview

Transform your designs with the TDA8002BT/5/C1 from NXP Semiconductors—where cutting-edge technology meets unparalleled reliability. This high-performance microprocessor circuit is engineered for superior efficiency, making it perfect for a wide range of applications from consumer electronics to industrial automation. With NXP's renowned quality and commitment to innovation, you gain not just a component, but a competitive edge that drives performance and enhances product longevity. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides good protection against environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Supports surface mount technology, making it ideal for compact PCB designs and minimizing space requirements.

Maximum Supply Voltage: 6.5 V

The higher supply voltage threshold allows versatile applications and compatibility with various electronic components.

Package Shape: RECTANGULAR

The rectangular shape is standardized for easier PCB layout and design, enhancing integration with other components.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for complex functionalities in microprocessor applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces board space, allowing for more components to be placed in tighter configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for applications in harsher environments.

Minimum Operating Temperature: -25 °C

The capability to function in low temperatures makes it versatile for outdoor and extreme condition applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in board design for optimal routing and component placement.

Maximum Seated Height: 2.65 mm

The low seated height allows for low-profile designs, which is critical in space-constrained environments.

Width: 7.5 mm

A compact width facilitates integration in small electronic devices without compromising on performance.

Length: 17.9 mm

The appropriate length contributes to effective layout on PCBs, supporting a range of configurations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product is capable of executing complex tasks in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, crucial for battery-powered and energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form promotes easier soldering and enhances the reliability of connections.

Maximum Supply Current: 9 mA

With a maximum supply current of 9 mA, this product consumes minimal power during operation.

Nominal Supply Voltage: 5 V

Operating at a standard 5 V supply voltage ensures compatibility with most existing electronic systems and power supplies.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with common soldering techniques and equipment.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8002BT/5/C1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

6.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

TDA8002BT/5/C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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