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TDA8002BT/3/C1-T

NXP Semiconductors

TDA8002BT/3/C1-T by NXP Semiconductors

TDA8002BT/3/C1-T by NXP Semiconductors is a CMOS microprocessor circuit with a supply voltage range of 3-6.5V and operates b/w -25 °C to 85 °C. It features a compact 28-terminal SO package, ideal for various electronic applications. Its small footprint (7.5mm x 17.9mm) ensures efficient space utilization in designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,384 parts In-Stock

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Anansix

USA . 1,206 parts In-Stock

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Vyrian

USA . 734 parts In-Stock

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One Stop Electronics

USA . 822 parts In-Stock

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$21.000

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822

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Corohmni

South Africa . 359 parts In-Stock

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$35.856

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359

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Corphita

USA . 4,063 parts In-Stock

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UNI Independent Distributors

Spain . 2,297 parts In-Stock

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Overview

Elevate your designs with the TDA8002BT/3/C1-T from NXP Semiconductors, a trusted leader in innovation. This versatile microprocessor circuit delivers reliability and efficiency in various applications, empowering your projects to thrive under diverse conditions, from -25 °C to 85 °C. Its compact design and low power requirements make it an ideal choice for enhancing performance without compromise. Choose NXP for unparalleled quality and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and longevity, making this product suitable for various applications.

Surface Mount: YES

Being surface mount allows for easier integration into compact PCB designs and better space utilization.

Maximum Supply Voltage: 6.5 V

With a maximum supply voltage of 6.5 V, this product offers flexibility in power supply options, accommodating varying circuit requirements.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for layout and space management on PCBs, making it a versatile choice for designers.

No. of Terminals: 28

Having 28 terminals provides a good number of connections, allowing for complex functionality within a compact format.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a low-profile design, which is essential for modern electronic applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V enhances compatibility with various low-power applications, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

Operating comfortably up to 85 °C allows this microprocessor to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this device is suitable for outdoor and industrial applications where temperature fluctuations are common.

Terminal Position: DUAL

The dual terminal position design enhances solderability and can improve signal routing on PCBs.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm supports compact design requirements while ensuring compatibility with various enclosure options.

Width: 7.5 mm

The width of 7.5 mm is ideal for tight spaces in circuit boards, making efficient use of available real estate.

Length: 17.9 mm

The length of 17.9 mm is optimal for multi-terminal configurations, balancing functionality and compact design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it enables complex processing tasks, making it versatile for various applications in electronics.

Technology: CMOS

The utilization of CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals ensure excellent solder joint reliability, ease of assembly, and improved performance in automated manufacturing.

Maximum Supply Current: 12 mA

A maximum supply current of 12 mA strikes a balance between performance and power efficiency, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes integration into standard electronic systems straightforward, ensuring widespread compatibility.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product is optimized for high-density applications, facilitating effective connections in small spaces.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8002BT/3/C1-T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

6.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

TDA8002BT/3/C1-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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