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TDA8002AT/3/C1

NXP Semiconductors

TDA8002AT/3/C1 by NXP Semiconductors

TDA8002AT/3/C1 by NXP is a CMOS microprocessor circuit with a max supply voltage of 6.5V and operates b/w -25 °C to 85 °C. It features a compact 28-terminal SO package, ideal for space-constrained applications. Perfect for various peripheral functions in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,211 parts In-Stock

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Vyrian

USA . 1,609 parts In-Stock

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Anansix

USA . 359 parts In-Stock

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359

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Corohmni

South Africa . 1,141 parts In-Stock

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$28.709

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One Stop Electronics

USA . 996 parts In-Stock

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$32.000

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996

$32.000

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UNI Independent Distributors

Spain . 5,554 parts In-Stock

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Corphita

USA . 1,671 parts In-Stock

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Overview

Elevate your designs with the TDA8002AT/3/C1 from NXP Semiconductors, a leader in advanced microprocessor technology. This robust, surface-mount IC combines efficiency and reliability for a variety of applications, from consumer electronics to automation systems. With exceptional performance across a wide temperature range, it ensures consistent quality and longevity. Trust in NXP’s expertise and unlock endless possibilities for innovation and value in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this microprocessor robust for various applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient use of PCB space, making it ideal for modern electronics.

Maximum Supply Voltage: 6.5 V

With a maximum supply voltage of 6.5 V, this product provides flexibility for use in a wide range of applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, facilitating better layout options in your design.

No. of Terminals: 28

Having 28 terminals allows for a variety of connections, enhancing the functionality and integration into your projects.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact footprint, making it suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows compatibility with low-power applications, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in a wide range of environments, suitable for industrial applications.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25 °C allows this product to function effectively even in harsh cold environments.

Terminal Position: DUAL

Dual terminal positioning improves placement options on the PCB, enhancing connectivity and design versatility.

Maximum Seated Height: 2.65 mm

A seated height of just 2.65 mm allows for low-profile designs, essential for modern electronic devices.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compact design and functionality, making it versatile for different applications.

Length: 17.9 mm

With a length of 17.9 mm, this IC can fit comfortably within a variety of electronic designs, allowing for flexible configurations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this component is capable of performing complex operations, making it suitable for advanced applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides enhanced soldering reliability, facilitating automated assembly and reducing assembly costs.

Maximum Supply Current: 12 mA

A maximum supply current of 12 mA indicates low power consumption, which is crucial for energy-efficient designs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is compatible with many existing systems and enhances ease of integration.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy routing and placement during PCB design, promoting efficient layout.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8002AT/3/C1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

6.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

TDA8002AT/3/C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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