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TDA8026ET/C2,551

NXP Semiconductors

TDA8026ET/C2,551 by NXP Semiconductors

NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.

Median Price

$3.728

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,345 parts In-Stock

1+ parts

$2.300

100+ parts

$2.250

1k+ parts

$2.210

10k+ parts

-

1,345

$2.300

$2.250

$2.210

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Arrow

USA . 61 parts In-Stock

1+ parts

$4.246

100+ parts

$3.693

1k+ parts

$3.215

10k+ parts

$3.215

61

$4.246

$3.693

$3.215

$3.215

Chip1Stop

Japan . 215 parts In-Stock

1+ parts

$5.520

100+ parts

$3.690

1k+ parts

$3.090

10k+ parts

$2.960

215

$5.520

$3.690

$3.090

$2.960

Mouser Electronics

USA . 313 parts In-Stock

1+ parts

$7.050

100+ parts

$4.120

1k+ parts

$3.130

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313

$7.050

$4.120

$3.130

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Future Electronics

Canada . 2,912 parts In-Stock

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$3.210

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$3.160

2,912

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$3.210

$3.160

Verical

USA . 416 parts In-Stock

1+ parts

-

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$3.190

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$3.050

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416

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$3.190

$3.050

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.861

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-

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500

$3.861

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Digiode

USA . 2,443 parts In-Stock

1+ parts

$4.034

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2,443

$4.034

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Vyrian

USA . 11,219 parts In-Stock

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11,219

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Anansix

USA . 2,505 parts In-Stock

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2,505

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TME

Poland . 146 parts In-Stock

1+ parts

-

100+ parts

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$3.560

10k+ parts

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146

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$3.560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 382 parts In-Stock

1+ parts

$2.710

100+ parts

-

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382

$2.710

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Corphita

USA . 1,847 parts In-Stock

1+ parts

$3.821

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1,847

$3.821

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.861

100+ parts

-

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1,000

$3.861

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Continental Prestige Electronics

USA . 115 parts In-Stock

1+ parts

$5.530

100+ parts

$3.800

1k+ parts

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10k+ parts

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115

$5.530

$3.800

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Corohmni

South Africa . 3,121 parts In-Stock

1+ parts

$46.885

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3,121

$46.885

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iodParts Technologies Inc.

India . 20,016 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,038 parts In-Stock

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14,038

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Microchip USA

USA . 9,574 parts In-Stock

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9,574

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UNI Independent Distributors

Spain . 7,954 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,353 parts In-Stock

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Perfect Parts

USA . 937 parts In-Stock

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937

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GreenTree Electronics

Israel . 832 parts In-Stock

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832

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Overview

Unlock the potential of your electronic devices with the TDA8026ET/C2,551 by NXP Semiconductors. Known for their top-quality products, NXP Semiconductors delivers cutting-edge solutions in the category of Other Function uPs,uCs & Peripheral ICs. This versatile microprocessor circuit offers a wide range of applications, ensuring seamless performance in various electronic devices. With a focus on value and innovation, NXP Semiconductors provides customers with reliable and advanced technology, making the TDA8026ET/C2,551 a must-have component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides a cost-effective and lightweight solution for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and labor costs.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, especially in applications where board real estate is limited.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with a wide range of systems and components, making it versatile in various applications.

No. of Terminals: 64

Having 64 terminals allows for a greater number of connections and functionalities, enhancing the product's performance and capabilities.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style facilitates high-density mounting, enabling the product to support complex circuit designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can perform reliably in a range of environmental conditions.

Minimum Operating Temperature: -25 °C

The product can operate in cold temperatures down to -25°C, making it suitable for various indoor and outdoor applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering to the PCB, enhancing the overall durability and reliability of the product.

Peak Reflow Temperature °C: 260

Supporting peak reflow temperature of 260°C ensures proper soldering and assembly during manufacturing, leading to consistent product quality.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as the peripheral IC type provides advanced processing capabilities and functionality to the product.

Terminal Form: BALL

Having ball terminal form improves electrical and mechanical connections, ensuring reliable performance of the product in demanding conditions.

Maximum Supply Current: 260 mA

Supporting a maximum supply current of 260 mA allows the product to handle higher power demands and operate efficiently without overheating.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and reduces the need for additional voltage regulation.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm enables high-density mounting, improving signal integrity and reducing the overall footprint of the product.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the product can withstand moderate exposure to moisture during handling and assembly processes, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8026ET/C2,551 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B64

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

260 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TDA8026ET/C2,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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