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TMS320DM6467CCUTV

Texas Instruments

TMS320DM6467CCUTV by Texas Instruments

TMS320DM6467CCUTV by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports various bus compatibilities like I2C, PCI, SPI, UART, and USB. Ideal for applications requiring a high-performance microprocessor circuit in a compact square package style.

Median Price

$83.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 753 parts In-Stock

1+ parts

$83.760

100+ parts

-

1k+ parts

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753

$83.760

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,309 parts In-Stock

1+ parts

$79.572

100+ parts

-

1k+ parts

-

10k+ parts

-

3,309

$79.572

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-

Vyrian

USA . 3,457 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

-

3,457

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 787 parts In-Stock

1+ parts

$20.620

100+ parts

-

1k+ parts

-

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787

$20.620

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-

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Parana Technologies

USA . 986 parts In-Stock

1+ parts

$63.914

100+ parts

-

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10k+ parts

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986

$63.914

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-

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Ampacity Inc.

Singapore . 508 parts In-Stock

1+ parts

$71.200

100+ parts

-

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508

$71.200

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$71.813

100+ parts

$68.222

1k+ parts

$64.632

10k+ parts

-

1,675

$71.813

$68.222

$64.632

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ChromeModa Solutions

Germany . 664 parts In-Stock

1+ parts

$71.813

100+ parts

$58.887

1k+ parts

-

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664

$71.813

$58.887

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Corphita

USA . 240 parts In-Stock

1+ parts

$75.384

100+ parts

-

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240

$75.384

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Corohmni

South Africa . 2,529 parts In-Stock

1+ parts

$100.762

100+ parts

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2,529

$100.762

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Microchip USA

USA . 2,395 parts In-Stock

1+ parts

$136.200

100+ parts

$133.830

1k+ parts

$132.650

10k+ parts

$131.460

2,395

$136.200

$133.830

$132.650

$131.460

DigiPath Technology Company

USA . 1,361 parts In-Stock

1+ parts

-

100+ parts

$64.747

1k+ parts

-

10k+ parts

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1,361

-

$64.747

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Overview

Discover the power of innovation with the TMS320DM6467CCUTV by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality products that exceed industry standards. The TMS320DM6467CCUTV falls under the category of Other Function uPs,uCs & Peripheral ICs and offers unparalleled value with its cutting-edge technology. With a wide range of applications, this microprocessor circuit provides exceptional performance and reliability. Experience the benefits of seamless integration and advanced functionality with the TMS320DM6467CCUTV. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the ICs, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.26 V

Optimal voltage level for efficient performance without risking damage to the ICs.

Package Shape: SQUARE

Compact shape that fits well on PCBs and allows for efficient use of space.

Bit Size: 32

Higher bit size allows for processing of larger data sets and more complex operations.

Power Supplies (V): 1.2,1.8,3.3

Supports a range of power supply options for flexibility in various applications.

No. of Terminals: 529

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Advanced package style that facilitates efficient heat dissipation and signal transmission.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at low supply voltage levels, increasing overall product stability.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for a variety of environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions without compromising performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides corrosion resistance and enhances electrical conductivity for improved reliability.

RAM Words: 8192

Sufficient memory capacity for storing and processing data in a wide range of applications.

Width: 19 mm

Compact width allows for efficient PCB layout and saves space in electronic devices.

External Data Bus Width: 16

Wider data bus width enables faster data transfer and processing speeds.

Peak Reflow Temperature °C: 245

Can withstand high reflow temperatures during assembly processes, ensuring proper solder joints.

Length: 19 mm

Compact length that complements the square package shape for efficient PCB placement.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables advanced processing capabilities and interfaces for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminals facilitate reliable and secure connections with the PCB for enhanced performance.

Nominal Supply Voltage: 1.2 V

Optimal nominal supply voltage for efficient and stable operation of the ICs.

Bus Compatibility: I2C; PCI; SPI; UART; USB

Supports various communication protocols for versatile connectivity with other devices.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and precise soldering on PCBs.

Format: FIXED POINT

Fixed-point format for precise arithmetic calculations and efficient data processing.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates robustness against moisture exposure during handling and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CCUTV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

I2C; PCI; SPI; UART; USB

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CCUTV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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