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TMS320DM6441BZWT

Texas Instruments

TMS320DM6441BZWT by Texas Instruments

TMS320DM6441BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words, operating at -40 to 85°C. It supports Ethernet, I2C, SPI, UART, and USB buses for various applications like multimedia systems and industrial automation due to its low profile grid array package.

Median Price

$43.764

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,405 parts In-Stock

1+ parts

$43.764

100+ parts

$38.901

1k+ parts

$28.604

10k+ parts

-

2,405

$43.764

$38.901

$28.604

-

Rochester

USA . 256 parts In-Stock

1+ parts

-

100+ parts

$41.130

1k+ parts

$36.800

10k+ parts

$34.630

256

-

$41.130

$36.800

$34.630

DigiKey

USA . 256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

256

-

-

-

-

Verical

USA . 123 parts In-Stock

1+ parts

-

100+ parts

$51.413

1k+ parts

$46.000

10k+ parts

$43.288

123

-

$51.413

$46.000

$43.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,730 parts In-Stock

1+ parts

$34.637

100+ parts

-

1k+ parts

-

10k+ parts

-

2,730

$34.637

-

-

-

Vyrian

USA . 3,193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,193

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 585 parts In-Stock

1+ parts

$30.661

100+ parts

$2,847.375

1k+ parts

$27.595

10k+ parts

-

585

$30.661

$2,847.375

$27.595

-

Corphita

USA . 1,075 parts In-Stock

1+ parts

$32.814

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

$32.814

-

-

-

DigiPath Technology Company

USA . 940 parts In-Stock

1+ parts

$33.762

100+ parts

-

1k+ parts

-

10k+ parts

-

940

$33.762

-

-

-

ChromeModa Solutions

Germany . 2,978 parts In-Stock

1+ parts

$34.451

100+ parts

$28.250

1k+ parts

-

10k+ parts

-

2,978

$34.451

$28.250

-

-

IDEA Electronic Components Group

UK . 2,304 parts In-Stock

1+ parts

$34.451

100+ parts

$32.728

1k+ parts

$31.006

10k+ parts

-

2,304

$34.451

$32.728

$31.006

-

Corohmni

South Africa . 733 parts In-Stock

1+ parts

$38.477

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$38.477

-

-

-

Ampacity Inc.

Singapore . 306 parts In-Stock

1+ parts

$67.450

100+ parts

-

1k+ parts

-

10k+ parts

-

306

$67.450

-

-

-

Microchip USA

USA . 1,326 parts In-Stock

1+ parts

$123.650

100+ parts

$121.500

1k+ parts

$120.420

10k+ parts

$119.350

1,326

$123.650

$121.500

$120.420

$119.350

Overview

Experience the power of cutting-edge technology with the TMS320DM6441BZWT by Texas Instruments. This high-quality product offers unmatched performance and reliability, making it a top choice for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category. With Texas Instruments' reputation for excellence, you can trust that this product will deliver value and benefits beyond your expectations. Upgrade your projects with the TMS320DM6441BZWT and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and insulating properties.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and making assembly more efficient.

Maximum Supply Voltage: 1.1 V

Operates efficiently at a low voltage, reducing power consumption and heat generation.

Package Shape: SQUARE

Square packages are easy to handle and provide a uniform mounting surface on the PCB.

Bit Size: 32

Provides a balance between processing power and complexity, suitable for a wide range of applications.

Power Supplies (V): 1.05/1.2,1.8,3.3

Supports a variety of power supply voltages, offering flexibility in system design.

No. of Terminals: 316

Sufficient number of terminals for connecting to other components and peripherals in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array and fine pitch design allow for high density mounting, saving space on the PCB.

Minimum Supply Voltage: 1 V

Can operate at low supply voltage levels, ensuring energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

Operates reliably at low temperatures, making it suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides reliable electrical connections and prevents corrosion for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and PCB assembly.

Maximum Seated Height: 1.4 mm

Low profile design saves space and allows for compact system designs.

RAM Words: 20480

Sufficient RAM capacity for storing and processing data efficiently.

Width: 16 mm

Compact width size for easy integration into various electronic devices.

External Data Bus Width: 48

Wide data bus width allows for fast data transfer and processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering and assembly during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure solder joints and reliable connections.

Length: 16 mm

Compact length size for space-saving PCB designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes a microprocessor circuit for advanced processing capabilities and system control.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form for reliable and secure connections on the PCB.

Nominal Supply Voltage: 1.05 V

Stable nominal supply voltage for consistent performance and efficient power usage.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Supports various communication protocols for connectivity with different devices and peripherals.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and secure connections on the PCB.

Format: FIXED POINT

Fixed-point format for accurate arithmetic and efficient data processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the component can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6441BZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B316

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6441BZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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