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TMS320DM6467TCUTD1

Texas Instruments

TMS320DM6467TCUTD1 by Texas Instruments

TMS320DM6467TCUTD1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. Ideal for industrial applications, it supports Ethernet, I2C, SPI, UART, and USB bus compatibility with a supply voltage range of 1.3-3.3V.

Median Price

$141.050

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,586 parts In-Stock

1+ parts

$127.841

100+ parts

$115.718

1k+ parts

$110.208

10k+ parts

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19,586

$127.841

$115.718

$110.208

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Chip1Stop

Japan . 65 parts In-Stock

1+ parts

$140.000

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65

$140.000

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Arrow

USA . 65 parts In-Stock

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$142.100

100+ parts

$133.720

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65

$142.100

$133.720

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Mouser Electronics

USA . 163 parts In-Stock

1+ parts

$242.900

100+ parts

$206.110

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163

$242.900

$206.110

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DigiKey

USA . 4 parts In-Stock

1+ parts

$242.900

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4

$242.900

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Verical

USA . 65 parts In-Stock

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$133.720

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65

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$133.720

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Distributors (In-Stock)

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Digiode

USA . 3,469 parts In-Stock

1+ parts

$121.449

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3,469

$121.449

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Vyrian

USA . 9,444 parts In-Stock

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9,444

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Chip Stock

USA . 2,600 parts In-Stock

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2,600

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Component Sense

UK . 14 parts In-Stock

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14

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Distributors (Availability)

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Parana Technologies

USA . 1,695 parts In-Stock

1+ parts

$71.809

100+ parts

-

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1,695

$71.809

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DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

$79.070

100+ parts

$72.745

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1,034

$79.070

$72.745

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ChromeModa Solutions

Germany . 4,461 parts In-Stock

1+ parts

$80.684

100+ parts

$66.161

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4,461

$80.684

$66.161

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IDEA Electronic Components Group

UK . 466 parts In-Stock

1+ parts

$80.684

100+ parts

$76.650

1k+ parts

$72.616

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466

$80.684

$76.650

$72.616

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Corohmni

South Africa . 2,983 parts In-Stock

1+ parts

$82.849

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2,983

$82.849

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Corphita

USA . 2,950 parts In-Stock

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$115.057

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$115.057

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Component Stockers USA

USA . 244 parts In-Stock

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$146.550

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244

$146.550

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QUARKTWIN TECHNOLOGY LTD

USA . 25,586 parts In-Stock

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25,586

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Lixinc

USA . 17,127 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,208 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,240 parts In-Stock

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Metaverse IC Inc.

Canada . 294 parts In-Stock

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294

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GreenTree Electronics

Israel . 252 parts In-Stock

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ChipstoGo Electronic ltd

UK . 8 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320DM6467TCUTD1 by Texas Instruments, a leading manufacturer in the industry. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering customers a wide range of applications and versatility. With its top-quality construction using PLASTIC/EPOXY material, this product guarantees durability and longevity. Get ready to elevate your projects with the TMS320DM6467TCUTD1, providing unmatched value, benefits, and advantages that will undoubtedly exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation and protects the components from overvoltage damage.

Package Shape: SQUARE

The square package shape offers uniformity and easy alignment during assembly, improving overall reliability.

Bit Size: 32

With a bit size of 32, the product can handle complex processing tasks and calculations efficiently.

Power Supplies (V): 1.3, 1.8/3.3

Having multiple power supply options allows for flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 529

The high number of terminals enables connectivity with various external components, expanding the product's functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style optimizes the layout for efficient signal routing and thermal management.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The product can withstand extreme cold temperatures down to -40°C, suitable for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and allows for efficient heat dissipation.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3 mm ensures compatibility with slim device profiles and compact designs.

RAM Words: 8192

With a large RAM capacity of 8192 words, the product can store and process a significant amount of data efficiently.

Width: 19 mm

The compact width of 19 mm facilitates space-saving installations and integration into tight spaces.

External Data Bus Width: 48

The wide external data bus width of 48 bits enables fast data transfers and high-speed processing capabilities.

Maximum Clock Frequency: 35 MHz

The high maximum clock frequency of 35 MHz allows for fast and responsive operation during processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures reliable soldering and component attachment during assembly.

Length: 19 mm

The compact length of 19 mm allows for versatile installations and compatibility with various enclosure sizes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions and industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC enhances the product's processing capabilities and overall functionality.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, ideal for energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable contact with the PCB, ensuring stable operation.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V ensures consistent and stable power delivery for reliable performance.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

The product's bus compatibility with Ethernet, I2C, SPI, UART, and USB interfaces allows for versatile connectivity options and integration with a wide range of devices.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and compact PCB designs, optimizing space utilization.

Format: FIXED POINT

The fixed-point format offers precise and efficient data processing capabilities, suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 4

The MSL level 4 indicates that the product is designed to withstand moderate exposure to moisture during handling and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467TCUTD1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467TCUTD1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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