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TMS320DM335DZCE135

Texas Instruments

TMS320DM335DZCE135 by Texas Instruments

TMS320DM335DZCE135 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low power consumption and high processing capabilities.

Median Price

$11.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$11.320

1k+ parts

$10.130

10k+ parts

$9.540

3

-

$11.320

$10.130

$9.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,252 parts In-Stock

1+ parts

$11.951

100+ parts

-

1k+ parts

-

10k+ parts

-

1,252

$11.951

-

-

-

Vyrian

USA . 5,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,613

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,309 parts In-Stock

1+ parts

$11.322

100+ parts

-

1k+ parts

-

10k+ parts

-

3,309

$11.322

-

-

-

Component Stockers USA

USA . 4 parts In-Stock

1+ parts

$12.730

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$12.730

-

-

-

AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$16.370

100+ parts

-

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-

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224

$16.370

-

-

-

Parana Technologies

USA . 134 parts In-Stock

1+ parts

$53.991

100+ parts

-

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-

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-

134

$53.991

-

-

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Corohmni

South Africa . 73 parts In-Stock

1+ parts

$58.495

100+ parts

-

1k+ parts

-

10k+ parts

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73

$58.495

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DigiPath Technology Company

USA . 1,261 parts In-Stock

1+ parts

$59.451

100+ parts

$54.695

1k+ parts

-

10k+ parts

-

1,261

$59.451

$54.695

-

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ChromeModa Solutions

Germany . 2,836 parts In-Stock

1+ parts

$60.664

100+ parts

$49.744

1k+ parts

-

10k+ parts

-

2,836

$60.664

$49.744

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IDEA Electronic Components Group

UK . 852 parts In-Stock

1+ parts

$60.664

100+ parts

$57.631

1k+ parts

$54.598

10k+ parts

-

852

$60.664

$57.631

$54.598

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QUARKTWIN TECHNOLOGY LTD

USA . 20,380 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,380

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Microchip USA

USA . 5,533 parts In-Stock

1+ parts

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5,533

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Overview

Experience the cutting-edge technology of the TMS320DM335DZCE135 by Texas Instruments, a top-of-the-line microprocessor circuit that pushes boundaries in performance and innovation. With a focus on quality and reliability, Texas Instruments delivers a product that exceeds expectations in a variety of applications. Whether you're working on IoT devices, industrial automation, or consumer electronics, this versatile solution offers unmatched value, benefits, and advantages to customers looking for seamless integration and optimal functionality. Elevate your projects with the TMS320DM335DZCE135 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and provides protection to the internal components of the product.

Surface Mount: YES

Being surface mountable makes the product suitable for compact and densely populated PCB designs, saving space and facilitating easier assembly.

Maximum Supply Voltage: 1.365V

The maximum supply voltage of 1.365V ensures efficient power consumption and prevents damage from overvoltage conditions.

Package Shape: SQUARE

The square package shape allows for easier alignment and positioning on the PCB, simplifying the assembly process.

Bit Size: 32

With a 32-bit size, the product can process data and instructions faster and handle larger amounts of information, enhancing overall performance.

Power Supplies (V): 1.3, 1.8, 3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with various power sources.

No. of Terminals: 337

The high number of terminals allows for more connectivity options and interfaces, enabling versatile applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style with grid array, low profile, and fine pitch design enhances thermal performance, facilitates high-density mounting, and enables better signal integrity.

Minimum Supply Voltage: 1.235V

The minimum supply voltage of 1.235V ensures reliable operation even under low power conditions, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand elevated temperatures, ensuring robust performance in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable functionality even in cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to solder and mount the product onto the PCB, improving assembly efficiency.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3 mm enables a slim and compact form factor, suitable for space-constrained applications.

RAM Words: 8192

With a large RAM capacity of 8192 words, the product can efficiently store and retrieve data, enhancing overall processing speed and performance.

Width: 13 mm

The width of 13 mm allows for a compact footprint, enabling the product to be integrated into tight spaces or small electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures that the product can withstand the reflow soldering process without damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability in the manufacturing process.

Length: 13 mm

The length of 13 mm complements the compact width, making the product suitable for space-efficient designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit type, the product offers advanced processing capabilities and supports complex functions, making it ideal for high-performance applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

The terminal form of ball allows for reliable solder connections and better mechanical strength, ensuring the longevity and robustness of the product.

Nominal Supply Voltage: 1.3V

The nominal supply voltage of 1.3V provides stable and consistent power delivery, ensuring reliable operation and performance of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting, precise alignment, and efficient signal transmission, enhancing overall product functionality.

Format: FIXED POINT

The fixed point format allows for efficient arithmetic operations and precise calculations, making the product suitable for applications requiring accurate numerical processing.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has a moderate sensitivity to moisture, requiring proper handling and storage to maintain its reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM335DZCE135 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM335DZCE135 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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