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TMS320DM6467CCUTA6

Texas Instruments

TMS320DM6467CCUTA6 by Texas Instruments

TMS320DM6467CCUTA6 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating b/w 0-85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring fixed-point format processing in various industries.

Median Price

$113.070

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 461 parts In-Stock

1+ parts

$113.070

100+ parts

-

1k+ parts

-

10k+ parts

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461

$113.070

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,600 parts In-Stock

1+ parts

$107.416

100+ parts

-

1k+ parts

-

10k+ parts

-

4,600

$107.416

-

-

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Vyrian

USA . 4,589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,589

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,160 parts In-Stock

1+ parts

$18.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,160

$18.300

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$41.289

100+ parts

$37.573

1k+ parts

$33.857

10k+ parts

-

1,000

$41.289

$37.573

$33.857

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Parana Technologies

USA . 1,939 parts In-Stock

1+ parts

$59.930

100+ parts

$5,565.403

1k+ parts

$53.937

10k+ parts

-

1,939

$59.930

$5,565.403

$53.937

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DigiPath Technology Company

USA . 1,938 parts In-Stock

1+ parts

$65.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

$65.990

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ChromeModa Solutions

Germany . 2,064 parts In-Stock

1+ parts

$67.337

100+ parts

$55.216

1k+ parts

-

10k+ parts

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2,064

$67.337

$55.216

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$67.337

100+ parts

$63.970

1k+ parts

$60.603

10k+ parts

-

1,283

$67.337

$63.970

$60.603

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Corohmni

South Africa . 2,472 parts In-Stock

1+ parts

$80.624

100+ parts

-

1k+ parts

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10k+ parts

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2,472

$80.624

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Corphita

USA . 1,853 parts In-Stock

1+ parts

$101.763

100+ parts

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1,853

$101.763

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Microchip USA

USA . 2,779 parts In-Stock

1+ parts

$124.980

100+ parts

$121.640

1k+ parts

$119.980

10k+ parts

$118.310

2,779

$124.980

$121.640

$119.980

$118.310

QUARKTWIN TECHNOLOGY LTD

USA . 14,614 parts In-Stock

1+ parts

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100+ parts

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14,614

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Overview

Discover the superior performance and reliability of the TMS320DM6467CCUTA6 by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology for a wide range of applications. Whether you are looking to enhance your audio/visual systems, communications equipment, or industrial control devices, this product offers unmatched value and benefits. With its advanced features and high-quality design, the TMS320DM6467CCUTA6 is sure to exceed your expectations and take your projects to the next level. Trust Texas Instruments for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the integrated circuits, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and increasing assembly speed.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures safe operation and prevents damage to the IC under high voltage conditions.

Package Shape: SQUARE

Square package shape facilitates efficient layout and assembly on PCBs, optimizing space utilization.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities and performance for advanced applications.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple supply voltages enables compatibility with various power sources and flexibility in system design.

No. of Terminals: 529

A high number of terminals allow for extensive connectivity options, enabling versatile interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package styles enhance signal integrity and reduce the risk of signal interference, improving overall performance.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures reliable operation even under low voltage conditions, enhancing the versatility of the IC.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85°C allows for stable performance in demanding environments and extends the IC's operational range.

Minimum Operating Temperature: 0 °C

The IC's ability to operate at a minimum temperature of 0°C ensures reliable functionality in cold conditions, expanding its utility across diverse applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish composition of tin, silver, and copper provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering onto the PCB, enhancing the IC's ease of installation in the system.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3mm allows for efficient vertical space utilization in compact designs, enabling sleek and space-saving electronic products.

RAM Words: 8192

The 8192 RAM words provide ample memory capacity for data storage and processing, supporting multitasking and complex operations.

Width: 19 mm

With a width of 19mm, the IC offers a compact form factor that can be easily integrated into tight spaces without compromising performance.

External Data Bus Width: 16

A wide external data bus width of 16 bits allows for high-speed data transfer and efficient communication between the IC and external devices.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures reliable solder joints during the assembly process, preventing soldering defects and ensuring product quality.

Length: 19 mm

The IC's length of 19mm complements its compact width, making it suitable for applications with space constraints while maintaining performance efficiency.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type enhances the IC's processing capabilities, enabling complex computations and efficient control of external devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the IC energy-efficient and reliable in operation.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections and enables high-density packaging, enhancing the overall performance and reliability of the IC.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V optimizes power efficiency and ensures stable operation in a variety of applications, enhancing the IC's versatility.

Bus Compatibility: I2C; PCI; SPI; UART; USB

Support for multiple bus interfaces such as I2C, PCI, SPI, UART, and USB enables seamless connectivity with various devices and systems, enhancing the IC's compatibility and usability.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for high-density packaging and efficient PCB layout, enabling compact and space-saving designs while maintaining connectivity versatility.

Format: FIXED POINT

The fixed-point format simplifies data representation and processing, enabling precise calculations and efficient execution of algorithms on the IC.

Moisture Sensitivity Level (MSL): 4

The MSL of 4 indicates that the IC can withstand exposure to moderate levels of moisture during storage or handling, ensuring product integrity and reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CCUTA6 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; PCI; SPI; UART; USB

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CCUTA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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