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TMS320DM6467TZUT9

Texas Instruments

TMS320DM6467TZUT9 by Texas Instruments

TMS320DM6467TZUT9 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3V, it has a max supply voltage of 1.365V and supports power supplies of 1.8/3.3V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring high performance in a compact form factor, with a package style of GRID ARRAY and FINE PITCH.

Median Price

$109.699

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$97.510

1k+ parts

$87.240

10k+ parts

$82.110

168

-

$97.510

$87.240

$82.110

DigiKey

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Verical

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$121.888

1k+ parts

$109.050

10k+ parts

$102.638

168

-

$121.888

$109.050

$102.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,909 parts In-Stock

1+ parts

$108.072

100+ parts

-

1k+ parts

-

10k+ parts

-

1,909

$108.072

-

-

-

DigiKey Marketplace

USA . 168 parts In-Stock

1+ parts

$112.670

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$112.670

-

-

-

Vyrian

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,704

-

-

-

-

Bristol Electronics

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

9

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,935 parts In-Stock

1+ parts

$20.725

100+ parts

-

1k+ parts

-

10k+ parts

-

1,935

$20.725

-

-

-

Parana Technologies

USA . 149 parts In-Stock

1+ parts

$48.561

100+ parts

$4,509.632

1k+ parts

$43.705

10k+ parts

-

149

$48.561

$4,509.632

$43.705

-

DigiPath Technology Company

USA . 610 parts In-Stock

1+ parts

$53.472

100+ parts

$49.194

1k+ parts

-

10k+ parts

-

610

$53.472

$49.194

-

-

ChromeModa Solutions

Germany . 4,943 parts In-Stock

1+ parts

$54.563

100+ parts

$44.742

1k+ parts

-

10k+ parts

-

4,943

$54.563

$44.742

-

-

IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$54.563

100+ parts

$51.835

1k+ parts

$49.107

10k+ parts

-

187

$54.563

$51.835

$49.107

-

Corphita

USA . 1,669 parts In-Stock

1+ parts

$102.384

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$102.384

-

-

-

Overview

Experience unparalleled performance and reliability with the TMS320DM6467TZUT9 by Texas Instruments. As a leader in innovation, Texas Instruments delivers cutting-edge technology in the category of Other Function uPs,uCs & Peripheral ICs. This versatile product offers unmatched value and benefits for a variety of applications, providing customers with a seamless and efficient user experience. Trust Texas Instruments to provide top-notch quality and advanced solutions for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight, durable, and cost-effective.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, saving time and labor costs.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation and protection of the product from overvoltage conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, maximizing component placement flexibility.

Bit Size: 32

The 32-bit size allows for high-speed processing and efficient handling of complex tasks, making the product suitable for advanced applications.

Power Supplies (V): 1.3, 1.8/3.3

The multiple power supply options (1.3 V, 1.8 V, 3.3 V) provide flexibility in operating voltage requirements, catering to various system designs.

No. of Terminals: 529

With a high number of terminals, the product offers extensive connectivity options, enabling versatile interfacing capabilities.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures secure mounting and reliable connections, essential for optimal performance in demanding applications.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V allows for efficient power usage while maintaining stable operation of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enhances the product's reliability in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can function effectively in a wide range of operating environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy integration into the circuit board layout, simplifying assembly and enhancing overall product performance.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3 mm allows for a compact design, enabling space-saving integration of the product in tight layouts.

RAM Words: 8192

With 8192 RAM words, the product offers ample memory capacity for efficient data storage and processing, suitable for multitasking applications.

Width: 19 mm

The 19 mm width provides a compact form factor, making the product suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper solder reflow and component reliability during assembly processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C enables efficient solder melting and component attachment during manufacturing processes.

Length: 19 mm

The 19 mm length contributes to the overall compactness of the product, facilitating easy integration into various electronic devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as the peripheral IC type enhances the product's processing capabilities, enabling complex functions and tasks.

Technology: CMOS

The CMOS technology ensures low power consumption, high speed, and reliable operation, making the product energy-efficient and dependable.

Terminal Form: BALL

The ball terminal form provides secure connections and easy soldering during assembly, enhancing the product's durability and performance.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V ensures stable and efficient operation, meeting the standard voltage requirements for the product.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for close spacing of terminals, optimizing connectivity and ensuring reliable electrical connections.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances the product's processing speed and accuracy, making it suitable for numerical calculations.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates the product's resistance to moisture-related issues, ensuring long-term reliability and performance in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467TZUT9 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467TZUT9 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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