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TMS320DM6467TCUT9

Texas Instruments

TMS320DM6467TCUT9 by Texas Instruments

TMS320DM6467TCUT9 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It features 8192 RAM words, 48-bit external data bus width, and supports Ethernet, I2C, SPI, UART & USB. Ideal for applications requiring high-speed processing in a compact form factor.

Median Price

$121.280

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,104 parts In-Stock

1+ parts

$104.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,104

$104.700

-

-

-

Rochester

USA . 96 parts In-Stock

1+ parts

$121.280

100+ parts

$114.000

1k+ parts

$106.730

10k+ parts

-

96

$121.280

$114.000

$106.730

-

DigiKey

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

96

-

-

-

-

Verical

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$142.500

1k+ parts

$133.412

10k+ parts

-

96

-

$142.500

$133.412

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,390 parts In-Stock

1+ parts

$99.465

100+ parts

-

1k+ parts

-

10k+ parts

-

3,390

$99.465

-

-

-

Vyrian

USA . 7,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,861

-

-

-

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Chip Stock

USA . 725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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725

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 413 parts In-Stock

1+ parts

$10.400

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$10.400

-

-

-

Parana Technologies

USA . 660 parts In-Stock

1+ parts

$61.146

100+ parts

$5,678.303

1k+ parts

$55.031

10k+ parts

-

660

$61.146

$5,678.303

$55.031

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DigiPath Technology Company

USA . 2,023 parts In-Stock

1+ parts

$67.329

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

$67.329

-

-

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ChromeModa Solutions

Germany . 6,332 parts In-Stock

1+ parts

$68.703

100+ parts

$56.336

1k+ parts

-

10k+ parts

-

6,332

$68.703

$56.336

-

-

IDEA Electronic Components Group

UK . 451 parts In-Stock

1+ parts

$68.703

100+ parts

$65.268

1k+ parts

$61.833

10k+ parts

-

451

$68.703

$65.268

$61.833

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Corphita

USA . 3,244 parts In-Stock

1+ parts

$94.230

100+ parts

-

1k+ parts

-

10k+ parts

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3,244

$94.230

-

-

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Corohmni

South Africa . 2,149 parts In-Stock

1+ parts

$108.320

100+ parts

-

1k+ parts

-

10k+ parts

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2,149

$108.320

-

-

-

Microchip USA

USA . 2,032 parts In-Stock

1+ parts

$122.450

100+ parts

$119.190

1k+ parts

$117.550

10k+ parts

$115.920

2,032

$122.450

$119.190

$117.550

$115.920

Overview

Experience unparalleled performance and reliability with the TMS320DM6467TCUT9 by Texas Instruments. As a leading manufacturer in the industry of Other Function uPs,uCs & Peripheral ICs, this product delivers exceptional value to customers by providing cutting-edge technology and versatile applications. With its advanced features and high-quality design, this microprocessor circuit offers a seamless experience for all your electronic needs. Trust Texas Instruments to deliver superior products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy assembly and integration into different electronic devices.

Maximum Supply Voltage: 1.365 V

Ideal for low power consumption applications.

Package Shape: SQUARE

Provides a compact form factor for space-constrained designs.

Bit Size: 32

Offers sufficient processing power for a wide range of applications.

Power Supplies (V): 1.3,1.8/3.3

Allows for flexibility in power input options.

No. of Terminals: 529

Enables connectivity to various components for enhanced functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Facilitates high-density mounting and efficient signal routing.

Minimum Supply Voltage: 1.235 V

Ensures stable operation even at low supply voltages.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in various temperature environments.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for long-term use.

Terminal Position: BOTTOM

Facilitates easy connectivity and soldering during assembly.

Maximum Seated Height: 3.3 mm

Allows for a slim and compact design.

RAM Words: 8192

Sufficient memory capacity for data processing and storage.

Width: 19 mm

Compact size for versatile integration into electronic devices.

External Data Bus Width: 48

High data throughput capability for efficient communication.

Maximum Clock Frequency: 35 MHz

Provides high-speed processing for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly for robust connection.

Peak Reflow Temperature °C: 245

Suitable for lead-free soldering processes.

Length: 19 mm

Compact form factor for space-efficient designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers versatile functionality for various applications.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Facilitates easy soldering and connection to PCBs.

Nominal Supply Voltage: 1.3 V

Optimal voltage for efficient performance and power consumption.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Supports multiple communication protocols for versatile connectivity.

Terminal Pitch: 0.8 mm

Allows for high-density mounting and efficient signal routing.

Format: FIXED POINT

Suitable for fixed-point arithmetic operations in embedded systems.

Moisture Sensitivity Level (MSL): 4

Resistant to moisture damage for enhanced reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467TCUT9 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467TCUT9 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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