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TMS320DM6443BZWT

Texas Instruments

TMS320DM6443BZWT by Texas Instruments

TMS320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. It operates at 1.14-1.26 V, suitable for MICROPROCESSOR CIRCUIT applications like ETHERNET, I2C, SPI, UART, and USB interfaces. The package style is GRID ARRAY with low profile and fine pitch design for compact setups.

Median Price

$44.053

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 707 parts In-Stock

1+ parts

$44.053

100+ parts

$39.158

1k+ parts

$28.793

10k+ parts

-

707

$44.053

$39.158

$28.793

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,197 parts In-Stock

1+ parts

$41.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,197

$41.850

-

-

-

Vyrian

USA . 1,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$13.980

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$13.980

-

-

-

Corphita

USA . 2,118 parts In-Stock

1+ parts

$39.648

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

$39.648

-

-

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$60.551

100+ parts

$5,623.093

1k+ parts

$54.496

10k+ parts

-

2,100

$60.551

$5,623.093

$54.496

-

DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

$66.674

100+ parts

$61.340

1k+ parts

-

10k+ parts

-

1,545

$66.674

$61.340

-

-

ChromeModa Solutions

Germany . 4,914 parts In-Stock

1+ parts

$68.035

100+ parts

$55.789

1k+ parts

-

10k+ parts

-

4,914

$68.035

$55.789

-

-

IDEA Electronic Components Group

UK . 2,002 parts In-Stock

1+ parts

$68.035

100+ parts

$64.633

1k+ parts

$61.232

10k+ parts

-

2,002

$68.035

$64.633

$61.232

-

Corohmni

South Africa . 652 parts In-Stock

1+ parts

$82.726

100+ parts

-

1k+ parts

-

10k+ parts

-

652

$82.726

-

-

-

Overview

Unleash the power of innovation with the TMS320DM6443BZWT by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it suitable for a wide range of applications. Offering unparalleled value and benefits, this product is designed to exceed customer expectations. Experience seamless performance and efficiency with the TMS320DM6443BZWT - your gateway to cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the integrated circuits inside, making the product resistant to damage and wear.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto printed circuit boards, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage allows for flexibility in power input requirements, accommodating a wider range of applications.

Package Shape: SQUARE

Square package shape facilitates easier placement and routing on PCBs, optimizing space efficiency in electronic designs.

Bit Size: 32

32-bit architecture enhances processing power and performance, enabling the product to handle complex computations and instructions efficiently.

Power Supplies (V): 1.2, 1.8/3.3

Multiple power supply options provide versatility in voltage selection, ensuring compatibility with various power sources.

No. of Terminals: 316

Large number of terminals allow for multiple connections and interfaces, enabling enhanced functionality and connectivity in the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high density and compactness, crucial for space-constrained electronic applications.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage ensures efficient power consumption, extending the product's battery life and reducing operating costs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows the product to function reliably in harsh environments or under extended operation durations.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature capability ensures stable performance in cold conditions, making the product suitable for a wide range of operating environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and soldering, simplifying the assembly process and enhancing overall product reliability.

Maximum Seated Height: 1.4 mm

Low maximum seated height minimizes the product's profile, contributing to space-saving designs and enabling compact electronic applications.

RAM Words: 20480

Large RAM capacity allows for efficient data storage and processing, enhancing the product's multitasking capabilities and overall performance.

Width: 16 mm

Compact width dimension enables the product to fit into small form factor devices, ideal for applications with limited space constraints.

External Data Bus Width: 48

Wide external data bus width enhances data transfer speeds and throughput, optimizing the product's performance in data-intensive operations.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures complete and reliable solder joint formation during assembly, enhancing product durability and strength.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables the product to withstand demanding soldering processes, ensuring robust connections and assembly quality.

Length: 16 mm

Compact length dimension contributes to the product's overall small footprint, ideal for applications requiring minimal space usage.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit peripheral IC type offers advanced processing capabilities and compatibility with various external devices, expanding the product's functionality and versatility.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making the product efficient and suitable for energy-efficient electronic applications.

Terminal Form: BALL

Ball terminal form ensures reliable and secure electrical connections, minimizing signal loss and impedance issues for improved product performance.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation, enhancing the product's overall performance and longevity.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Broad bus compatibility allows seamless integration with various communication protocols and standards, expanding the product's connectivity options and interoperability.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density layout designs, optimizing PCB real estate and facilitating compact electronic product designs.

Format: FIXED POINT

Fixed point format simplifies mathematical calculations and data processing, enhancing the product's computational efficiency and accuracy.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level helps determine proper handling and storage requirements to prevent moisture-related damage, ensuring the product's reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6443BZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B316

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

20480

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6443BZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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