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TMS320DM6467CCUTA

Texas Instruments

TMS320DM6467CCUTA by Texas Instruments

TMS320DM6467CCUTA by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates b/w 0-85°C, supports I2C, PCI, SPI, UART, USB buses and has a supply voltage range of 1.14-1.26V. Ideal for applications requiring high processing power in compact designs.

Median Price

$91.788

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 22 parts In-Stock

1+ parts

$16.880

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22

$16.880

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Chip1Stop

Japan . 22 parts In-Stock

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$89.200

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22

$89.200

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Verical

USA . 22 parts In-Stock

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$94.377

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22

$94.377

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Texas Instruments

USA . 2,470 parts In-Stock

1+ parts

$100.509

100+ parts

$97.487

1k+ parts

$75.571

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-

2,470

$100.509

$97.487

$75.571

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 4 parts In-Stock

1+ parts

$20.692

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4

$20.692

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Digiode

USA . 2,267 parts In-Stock

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$40.090

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2,267

$40.090

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Vyrian

USA . 5,801 parts In-Stock

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5,801

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Connect4Technologies Inc.

Canada . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$18.430

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642

$18.430

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Parana Technologies

USA . 2,053 parts In-Stock

1+ parts

$34.469

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2,053

$34.469

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DigiPath Technology Company

USA . 1,156 parts In-Stock

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$37.954

100+ parts

$34.918

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1,156

$37.954

$34.918

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Corphita

USA . 512 parts In-Stock

1+ parts

$37.980

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512

$37.980

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ChromeModa Solutions

Germany . 6,040 parts In-Stock

1+ parts

$38.729

100+ parts

$31.758

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6,040

$38.729

$31.758

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IDEA Electronic Components Group

UK . 191 parts In-Stock

1+ parts

$38.729

100+ parts

$36.793

1k+ parts

$34.856

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191

$38.729

$36.793

$34.856

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Corohmni

South Africa . 2,908 parts In-Stock

1+ parts

$50.793

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2,908

$50.793

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Component Stockers USA

USA . 15 parts In-Stock

1+ parts

$108.450

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15

$108.450

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Microchip USA

USA . 454 parts In-Stock

1+ parts

$139.280

100+ parts

$137.430

1k+ parts

$137.430

10k+ parts

$135.570

454

$139.280

$137.430

$137.430

$135.570

QUARKTWIN TECHNOLOGY LTD

USA . 19,632 parts In-Stock

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19,632

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Overview

Experience unparalleled performance and reliability with the TMS320DM6467CCUTA by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that meets the highest standards of quality. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With its advanced features and innovative design, this product provides exceptional value to customers, ensuring seamless operation and optimal efficiency. Trust Texas Instruments to provide you with the best in class products that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and cost during manufacturing.

Maximum Supply Voltage: 1.26 V

Having a higher maximum supply voltage allows for more flexibility in power input options, making it compatible with a wider range of systems.

Package Shape: SQUARE

The square shape of the package allows for easier integration into circuit designs, optimizing space usage and layout efficiency.

Bit Size: 32

With a 32-bit architecture, the product can handle larger amounts of data and calculations, providing better performance for applications that require high processing power.

Power Supplies (V): 1.2, 1.8, 3.3

Supporting multiple power supply voltages gives users the flexibility to choose the appropriate voltage for their specific application, enhancing compatibility and versatility.

No. of Terminals: 529

Having a high number of terminals allows for a greater number of connections and functionalities, making the product suitable for complex electronic systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design of the package style enables high-density packaging, reducing the overall footprint of the product and improving signal integrity.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage helps in reducing power consumption and heat generation, increasing energy efficiency and reliability of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures allows the product to be used in a variety of environments, including refrigeration systems and outdoor applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The choice of terminal finish materials provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the product.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier and more secure mounting onto circuit boards, improving overall stability and durability of the product.

Maximum Seated Height: 3.3 mm

The low maximum seated height allows for a compact and slim design of the product, making it suitable for applications where space is limited.

RAM Words: 8192

With a large RAM capacity, the product can handle extensive data storage and processing requirements, allowing for efficient multitasking and faster operation.

Width: 19 mm

The compact width of the product makes it easy to integrate into tight spaces or densely populated circuit layouts, enabling efficient design and installation.

External Data Bus Width: 16

The 16-bit external data bus width enables faster data transfer and communication between the product and external components, enhancing overall performance and efficiency.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product can handle complex calculations and control tasks, making it suitable for a wide range of applications requiring high computational power.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Terminal Form: BALL

The ball terminal form facilitates easy connections and soldering onto circuit boards, ensuring secure and reliable electrical contacts for the product.

Nominal Supply Voltage: 1.2 V

Having a stable nominal supply voltage simplifies power management and ensures consistent performance of the product across varying operating conditions.

Bus Compatibility: I2C; PCI; SPI; UART; USB

Supporting multiple bus interfaces allows for seamless connectivity with various devices and systems, enhancing interoperability and versatility of the product.

Terminal Pitch: 0.8 mm

With a small terminal pitch, the product can accommodate more terminals in a limited space, enabling higher density packaging and reducing footprint on circuit boards.

Format: FIXED POINT

The fixed-point format simplifies data processing and arithmetic operations, providing efficient computational capabilities for the product in real-time applications.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the product is robust against moisture ingress, making it suitable for handling in humid or damp environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CCUTA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; PCI; SPI; UART; USB

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CCUTA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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