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AM6231ATCGHAALW

Texas Instruments

AM6231ATCGHAALW by Texas Instruments

AM6231ATCGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring very thin profile and fine pitch components.

Median Price

$13.781

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,162 parts In-Stock

1+ parts

$13.781

100+ parts

$12.038

1k+ parts

$8.302

10k+ parts

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3,162

$13.781

$12.038

$8.302

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 305 parts In-Stock

1+ parts

$13.092

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305

$13.092

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Vyrian

USA . 5,558 parts In-Stock

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5,558

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,799 parts In-Stock

1+ parts

$11.710

100+ parts

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2,799

$11.710

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Semicontronic

India . 2,691 parts In-Stock

1+ parts

$11.710

100+ parts

$11.417

1k+ parts

$11.359

10k+ parts

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2,691

$11.710

$11.417

$11.359

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Corphita

USA . 4,599 parts In-Stock

1+ parts

$12.403

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4,599

$12.403

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Corohmni

South Africa . 211 parts In-Stock

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$13.781

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211

$13.781

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AZTECH Wire

Italy . 964 parts In-Stock

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$16.170

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964

$16.170

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Native Components

USA . 973 parts In-Stock

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973

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Northwest PG Solutions

USA . 34 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM6231ATCGHAALW by Texas Instruments. This innovative product boasts top-tier quality and reliability, backed by a reputable manufacturer known for pushing the boundaries of what's possible in the industry. Perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product offers unparalleled value and benefits to customers. Experience top-notch performance and efficiency with the AM6231ATCGHAALW, setting new standards in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and electrical insulation for the product.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 0.79 V

Allows for safe and efficient operation within specified limits.

Package Shape: SQUARE

Provides a compact and space-saving design for the product.

No. of Terminals: 425

Allows for multiple connections and functionalities in the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enhances the product's performance and overall functionality with its advanced design.

Minimum Supply Voltage: 0.715 V

Ensures stable operation even at low voltage levels.

Maximum Operating Temperature: 105 °C

Ensures the product can perform reliably in varying temperature conditions.

Minimum Operating Temperature: -40 °C

Allows the product to operate in extreme cold conditions without issues.

Terminal Position: BOTTOM

Facilitates easy connection and integration of the product into a larger system.

Maximum Seated Height: 0.89 mm

Helps maintain a low profile and compact design for the product.

Width: 13 mm

Optimal width for fitting into various applications without taking up too much space.

Peak Reflow Temperature °C: 250

Can withstand high-temperature reflow processes during assembly.

Length: 13 mm

Complements the width for a compact and space-efficient product design.

Peripheral IC Type: SoC

Integration of multiple functions in a single chip for enhanced performance.

Technology: CMOS

Ensures low power consumption and high noise immunity for the product.

Terminal Form: BALL

Enhances connectivity and reliability of the product's electrical connections.

Nominal Supply Voltage: 0.75 V

Optimal voltage level for efficient and stable operation of the product.

Terminal Pitch: 0.5 mm

Close terminal spacing allows for more terminals and functions in the product.

Moisture Sensitivity Level (MSL): 3

Indicates the sensitivity to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6231ATCGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6231ATCGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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