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AM68A92ATGGHAALZR

Texas Instruments

AM68A92ATGGHAALZR by Texas Instruments

AM68A92ATGGHAALZR by Texas Instruments is a SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.76V to 0.84V. This IC has 770 terminals in a grid array package style, suitable for various applications requiring high performance and compact design.

Median Price

$273.810

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,182 parts In-Stock

1+ parts

$96.613

100+ parts

$85.879

1k+ parts

$63.146

10k+ parts

-

1,182

$96.613

$85.879

$63.146

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Mouser Electronics

USA . 240 parts In-Stock

1+ parts

$273.810

100+ parts

$225.810

1k+ parts

$209.710

10k+ parts

-

240

$273.810

$225.810

$209.710

-

DigiKey

USA . 185 parts In-Stock

1+ parts

$273.810

100+ parts

$225.823

1k+ parts

$210.273

10k+ parts

-

185

$273.810

$225.823

$210.273

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,776 parts In-Stock

1+ parts

$91.782

100+ parts

-

1k+ parts

-

10k+ parts

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1,776

$91.782

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-

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Vyrian

USA . 5,352 parts In-Stock

1+ parts

-

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5,352

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 862 parts In-Stock

1+ parts

$7.933

100+ parts

-

1k+ parts

-

10k+ parts

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862

$7.933

-

-

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Northwest PG Solutions

USA . 794 parts In-Stock

1+ parts

$8.726

100+ parts

$7.854

1k+ parts

-

10k+ parts

-

794

$8.726

$7.854

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-

Ampacity Inc.

Singapore . 280 parts In-Stock

1+ parts

$82.120

100+ parts

-

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-

10k+ parts

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280

$82.120

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-

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Semicontronic

India . 239 parts In-Stock

1+ parts

$82.120

100+ parts

$80.067

1k+ parts

$79.656

10k+ parts

-

239

$82.120

$80.067

$79.656

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Corphita

USA . 3,752 parts In-Stock

1+ parts

$86.952

100+ parts

-

1k+ parts

-

10k+ parts

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3,752

$86.952

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$96.613

100+ parts

-

1k+ parts

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10k+ parts

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432

$96.613

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Microchip USA

USA . 2,740 parts In-Stock

1+ parts

$159.820

100+ parts

$157.040

1k+ parts

$155.650

10k+ parts

$154.260

2,740

$159.820

$157.040

$155.650

$154.260

Overview

Experience the cutting-edge technology of AM68A92ATGGHAALZR by Texas Instruments, a leading manufacturer known for superior quality and reliability. This innovative product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With a compact square package and 770 terminals, this GRID ARRAY, FINE PITCH style IC provides maximum supply voltage of 0.84 V and operates flawlessly in temperatures ranging from -40 to 105°C. Elevate your projects with the unmatched performance and efficiency of AM68A92ATGGHAALZR, delivering exceptional value and benefits to customers seeking top-notch solutions in the field of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the integrated circuits within.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 0.84 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square shape allows for efficient use of space on circuit boards.

No. of Terminals: 770

The high number of terminals provides versatility and connectivity options for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style allows for high density mounting of the ICs, saving space on the PCB.

Minimum Supply Voltage: 0.76 V

The low minimum supply voltage ensures efficient power usage and compatibility with low power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability and performance under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without performance degradation.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and allows for easier connections.

Maximum Seated Height: 2.57 mm

The low maximum seated height enables compact design and efficient use of space in electronic devices.

Width: 23 mm

The moderate width of 23mm provides a balance between space savings and ease of handling during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and robust solder joints during assembly.

Length: 23 mm

The moderate length of 23mm provides a balance between space savings and ease of handling during assembly.

Peripheral IC Type: SoC

The System on Chip (SoC) design integrates multiple functions into a single chip, reducing component count and board space requirements.

Technology: CMOS

The Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for improved performance.

Terminal Form: BALL

The ball terminal form allows for reliable electrical connections and is suitable for surface mount applications.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage provides a stable operating voltage for the ICs, ensuring consistent performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm enables high density mounting and allows for compact design of the PCB.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the ICs have moderate moisture sensitivity, requiring standard handling and storage procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM68A92ATGGHAALZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B770

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

770

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA770,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.57 mm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

SoC

Trade Compliance

AM68A92ATGGHAALZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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