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AM68A72AHGGHAALZR

Texas Instruments

AM68A72AHGGHAALZR by Texas Instruments

AM68A72AHGGHAALZR by Texas Instruments is a PLASTIC/EPOXY package with 770 terminals. It operates at a voltage range of 0.76 V to 0.84 V and has a max operating temperature of 105 °C. This SoC peripheral IC is suitable for various applications requiring fine pitch grid array technology.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,544 parts In-Stock

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Digiode

USA . 4,499 parts In-Stock

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VNN

France . 50 parts In-Stock

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Nova Conductors

Japan . 20 parts In-Stock

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One Stop Electronics

USA . 388 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 529 parts In-Stock

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Ampacity Inc.

Singapore . 739 parts In-Stock

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Continental Prestige Electronics

USA . 6,023 parts In-Stock

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Argo Parts USA

USA . 2,912 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Upgrade your electronics with the AM68A72AHGGHAALZR by Texas Instruments. This high-quality, innovative product is designed to enhance your devices and deliver outstanding performance. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Whether you need it for consumer electronics, automotive applications, or industrial equipment, the AM68A72AHGGHAALZR offers unmatched value, benefits, and advantages. Experience superior functionality, reliability, and efficiency while enjoying the convenience of a compact design. Don't settle for less when you can have the best with the AM68A72AHGGHAALZR from Texas Instruments. Upgrade today and elevate your electronics to a whole new level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the product, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this product can be easily mounted on circuit boards, allowing for efficient and space-saving integration in electronic devices.

Maximum Supply Voltage: 0.84 V

With a maximum supply voltage of 0.84 V, this product ensures low power consumption and can be used in energy-efficient applications.

Package Shape: SQUARE

The square package shape provides a compact design, making it suitable for applications where space is limited.

No. of Terminals: 770

Being equipped with a high number of terminals, this product allows for versatile connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density integration of the product, making it suitable for applications that require multiple components in a limited space.

Minimum Supply Voltage: 0.76 V

With a minimum supply voltage of 0.76 V, this product can operate efficiently even in low-power scenarios, making it an ideal choice for battery-powered devices.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand demanding environments and perform reliably under high-temperature conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate in temperatures as low as -40°C makes it suitable for use in extreme cold environments.

Terminal Position: BOTTOM

Having the terminal position at the bottom simplifies circuit board layout and allows for easier connections, facilitating efficient assembly and maintenance processes.

Maximum Seated Height: 2.57 mm

The maximum seated height of 2.57 mm ensures a low-profile design when the product is mounted, enabling it to be employed in applications with tight height constraints.

Width: 23 mm

The 23 mm width provides a compact form factor, allowing for easier integration into various electronic devices.

Length: 23 mm

Having a length of 23 mm further contributes to the product's compact design, making it an ideal choice for applications with limited space.

Peripheral IC Type: SoC

This product being a System-on-Chip (SoC) offers integrated functionality, combining multiple functions into a single chip, simplifying designs, reducing system complexity, and enhancing overall performance.

Technology: CMOS

The use of Complementary Metal-Oxide-Semiconductor (CMOS) technology in this product ensures low power consumption, high integration, and excellent noise immunity, making it a reliable and energy-efficient choice.

Terminal Form: BALL

The ball terminal form facilitates better electrical conduction and improved soldering connections, ensuring reliable and stable performance of the product.

Nominal Supply Voltage: 0.8 V

With a nominal supply voltage of 0.8 V, this product offers a standardized voltage level, enhancing compatibility and ease of use in various applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise and compact connections, making it suitable for miniaturized circuit designs and high-density applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM68A72AHGGHAALZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B770

Length:

23 mm

No. of Terminals:

770

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA770,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.57 mm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

SoC

Trade Compliance

AM68A72AHGGHAALZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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