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DRA821U4TCBALMRQ1

Texas Instruments

DRA821U4TCBALMRQ1 by Texas Instruments

DRA821U4TCBALMRQ1 by Texas Instruments is a SoC peripheral IC with 433 terminals in a grid array package. It operates b/w -40 to 125 °C, with supply voltage ranging from 0.76V to 0.84V. Suitable for automotive applications due to AEC-Q100 screening and fine pitch design.

Median Price

$62.282

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,123 parts In-Stock

1+ parts

$47.415

100+ parts

$42.146

1k+ parts

$30.990

10k+ parts

-

2,123

$47.415

$42.146

$30.990

-

Mouser Electronics

USA . 416 parts In-Stock

1+ parts

$77.150

100+ parts

$57.530

1k+ parts

$54.970

10k+ parts

-

416

$77.150

$57.530

$54.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$40.786

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$40.786

-

-

-

Digiode

USA . 4,599 parts In-Stock

1+ parts

$45.044

100+ parts

-

1k+ parts

-

10k+ parts

-

4,599

$45.044

-

-

-

Vyrian

USA . 8,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,246

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$39.971

100+ parts

-

1k+ parts

$38.372

10k+ parts

-

1,000

$39.971

-

$38.372

-

Ampacity Inc.

Singapore . 1,076 parts In-Stock

1+ parts

$40.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,076

$40.300

-

-

-

Continental Prestige Electronics

USA . 801 parts In-Stock

1+ parts

$40.786

100+ parts

-

1k+ parts

-

10k+ parts

$39.971

801

$40.786

-

-

$39.971

Corphita

USA . 4,866 parts In-Stock

1+ parts

$42.674

100+ parts

-

1k+ parts

-

10k+ parts

-

4,866

$42.674

-

-

-

Component Stockers USA

USA . 1,067 parts In-Stock

1+ parts

$50.580

100+ parts

$43.040

1k+ parts

-

10k+ parts

-

1,067

$50.580

$43.040

-

-

Microchip USA

USA . 1,964 parts In-Stock

1+ parts

$93.808

100+ parts

-

1k+ parts

-

10k+ parts

-

1,964

$93.808

-

-

-

Argo Parts USA

USA . 3,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,015

-

-

-

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Overview

Unlock the power of cutting-edge technology with the DRA821U4TCBALMRQ1 by Texas Instruments. This innovative product delivers top-notch quality and reliability, setting it apart in the market of Other Function uPs,uCs & Peripheral ICs. Designed with precision and expertise, this device offers a wide range of applications for various industries. Experience seamless performance, unparalleled efficiency, and unmatched value with this groundbreaking solution. Trust Texas Instruments to provide you with the best in class products that exceed expectations and deliver exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to various environmental conditions, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and minimizing assembly costs.

Maximum Supply Voltage: 0.84 V

The high maximum supply voltage ensures stable and reliable operation under varying power conditions.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures that the product meets the rigorous automotive industry standards for quality and reliability.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, contributing to a compact overall design.

No. of Terminals: 433

The high number of terminals enables connectivity to a wide range of external components, offering versatility in application.

Package Style (Meter): GRID ARRAY, FINE PITCH

This package style offers high-density integration and precise connections, enhancing performance and reliability.

Minimum Supply Voltage: 0.76 V

The low minimum supply voltage ensures compatibility with various power sources, increasing flexibility in usage.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring stable performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold environments, enhancing the product's usability in diverse settings.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and assembly, simplifying the manufacturing process.

Maximum Seated Height: 2.57 mm

The low seated height enables a slim and compact design, ideal for space-constrained applications.

Width: 17.2 mm

The moderate width allows for easy integration into various electronic systems, offering compatibility with standard PCB sizes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures reliable soldering during assembly, contributing to a robust and durable product.

Length: 17.2 mm

The moderate length provides a balanced form factor, suitable for a wide range of PCB layouts and enclosure sizes.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single IC, reducing component count and enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable signal processing.

Terminal Form: BALL

The ball terminal form provides reliable contact and connection, reducing the risk of connection failures and ensuring stable operation.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage offers a standard operating range, ensuring compatibility with common power sources.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting, enabling compact PCB designs and efficient use of space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to ensure product reliability.

Speed: 2000 rpm

The high speed specification is suitable for applications requiring fast data processing and response times, enhancing overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA821U4TCBALMRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B433

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

433

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA433,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.57 mm

Speed:

2000 rpm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

SoC

Trade Compliance

DRA821U4TCBALMRQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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