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DRA829VMTGBALFRQ1

Texas Instruments

DRA829VMTGBALFRQ1 by Texas Instruments

DRA829VMTGBALFRQ1 by Texas Instruments is a SoC with 827 terminals in a grid array package. It operates b/w -40 to 125 °C with supply voltage range of 0.76V to 0.84V. This IC is designed for automotive applications meeting AEC-Q100 standards.

Median Price

$90.590

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 688 parts In-Stock

1+ parts

$83.231

100+ parts

$80.728

1k+ parts

$62.580

10k+ parts

-

688

$83.231

$80.728

$62.580

-

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$97.950

100+ parts

$86.190

1k+ parts

$80.270

10k+ parts

-

7

$97.950

$86.190

$80.270

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 620 parts In-Stock

1+ parts

$79.069

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$79.069

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-

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Vyrian

USA . 2,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,828

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 483 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$2.070

-

-

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Northwest PG Solutions

USA . 1,064 parts In-Stock

1+ parts

$2.277

100+ parts

-

1k+ parts

-

10k+ parts

-

1,064

$2.277

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-

-

Parana Technologies

USA . 55 parts In-Stock

1+ parts

$27.249

100+ parts

-

1k+ parts

$33.678

10k+ parts

-

55

$27.249

-

$33.678

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DigiPath Technology Company

USA . 45 parts In-Stock

1+ parts

$30.005

100+ parts

-

1k+ parts

-

10k+ parts

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45

$30.005

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-

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ChromeModa Solutions

Germany . 2,407 parts In-Stock

1+ parts

$30.617

100+ parts

$25.106

1k+ parts

-

10k+ parts

-

2,407

$30.617

$25.106

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

1+ parts

$30.617

100+ parts

$29.086

1k+ parts

$27.555

10k+ parts

-

1,678

$30.617

$29.086

$27.555

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Ampacity Inc.

Singapore . 348 parts In-Stock

1+ parts

$70.750

100+ parts

-

1k+ parts

-

10k+ parts

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348

$70.750

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-

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Semicontronic

India . 348 parts In-Stock

1+ parts

$70.750

100+ parts

$68.981

1k+ parts

$68.628

10k+ parts

-

348

$70.750

$68.981

$68.628

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Corphita

USA . 3,690 parts In-Stock

1+ parts

$74.908

100+ parts

-

1k+ parts

-

10k+ parts

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3,690

$74.908

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Corohmni

South Africa . 383 parts In-Stock

1+ parts

$83.231

100+ parts

-

1k+ parts

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10k+ parts

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383

$83.231

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Overview

Unleash the power of innovation with the DRA829VMTGBALFRQ1 by Texas Instruments. This cutting-edge product represents the pinnacle of quality and reliability that TI is renowned for, making it the perfect choice for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With its advanced technology and superior performance, this product offers unparalleled value and benefits to customers looking to stay ahead of the competition. Experience the advantages of Texas Instruments and take your projects to the next level with the DRA829VMTGBALFRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.84 V

The high maximum supply voltage ensures compatibility with various power sources, offering flexibility in different operating conditions.

Package Shape: SQUARE

The square package shape provides uniformity in design and facilitates proper alignment during assembly, reducing the risk of errors.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand tough environmental conditions and operate reliably in challenging situations.

Terminal Finish: TIN SILVER COPPER

The use of tin/silver/copper terminal finish ensures good electrical conductivity and corrosion resistance, maintaining signal integrity over time.

Width: 24 mm

The compact width of 24mm allows for efficient use of PCB space, enabling dense packing of components for increased functionality within a limited area.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functionalities into a single chip, reducing component count, improving efficiency, and enhancing overall performance.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage of 0.8V ensures stable and consistent operation, meeting the power requirements of the device without exceeding safety limits.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA829VMTGBALFRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B827

JESD-609 Code:

e1

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

827

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA827,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.8 mm

Speed:

2000 rpm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

SoC

Trade Compliance

DRA829VMTGBALFRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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