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AM6232ATCGHAALW

Texas Instruments

AM6232ATCGHAALW by Texas Instruments

AM6232ATCGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-density integration and low power consumption.

Median Price

$22.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,742 parts In-Stock

1+ parts

$15.641

100+ parts

$13.662

1k+ parts

$9.422

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3,742

$15.641

$13.662

$9.422

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DigiKey

USA . 272 parts In-Stock

1+ parts

$22.690

100+ parts

$17.054

1k+ parts

$14.792

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272

$22.690

$17.054

$14.792

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Mouser Electronics

USA . 187 parts In-Stock

1+ parts

$24.860

100+ parts

$18.760

1k+ parts

$16.570

10k+ parts

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187

$24.860

$18.760

$16.570

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,238 parts In-Stock

1+ parts

$14.859

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1,238

$14.859

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Vyrian

USA . 3,008 parts In-Stock

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3,008

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Distributors (Availability)

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Native Components

USA . 653 parts In-Stock

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$1.630

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653

$1.630

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Northwest PG Solutions

USA . 852 parts In-Stock

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$1.793

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852

$1.793

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Semicontronic

India . 1,337 parts In-Stock

1+ parts

$13.290

100+ parts

$12.958

1k+ parts

$12.891

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1,337

$13.290

$12.958

$12.891

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Ampacity Inc.

Singapore . 1,142 parts In-Stock

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$13.290

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Corphita

USA . 2,730 parts In-Stock

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$14.077

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2,730

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Corohmni

South Africa . 331 parts In-Stock

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$15.641

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Overview

Unleash the power of cutting-edge technology with the AM6232ATCGHAALW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in every product they produce. This innovative IC falls under the category of Other Function uPs,uCs & Peripheral ICs, offering limitless possibilities for various applications. With a compact square package design and a wide temperature range, this IC is perfect for demanding environments. Experience seamless performance and unmatched efficiency with the AM6232ATCGHAALW - your ultimate solution for all your electronic needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 0.79 V

Allows for a higher supply voltage which can improve performance and functionality of the product.

Package Shape: SQUARE

Square shape can save space and allow for efficient placement on a circuit board.

No. of Terminals: 425

Having a higher number of terminals allows for more connections and versatility in design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enables compact design and high density integration.

Minimum Supply Voltage: 0.715 V

Lower minimum supply voltage can enhance energy efficiency and extend battery life.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures product reliability and functionality in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures makes the product suitable for a wide range of applications and environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections, improving overall performance.

Maximum Seated Height: 0.89 mm

Low seated height allows for compact design and space-saving integration in electronic devices.

Width: 13 mm

Compact width enables efficient use of board space and sleek design.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures reliable soldering connections and product durability.

Length: 13 mm

Small length size allows for easy integration and placement on a circuit board.

Peripheral IC Type: SoC

System-on-Chip (SoC) design consolidates multiple functions into a single integrated circuit, reducing the need for external components and improving overall efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reduced noise, making the product energy-efficient and high performing.

Terminal Form: BALL

Ball terminal form provides reliable connections and ease of assembly during manufacturing.

Nominal Supply Voltage: 0.75 V

Stable nominal supply voltage ensures consistent and reliable performance of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration and precise connection on a circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has moderate sensitivity to moisture, making it suitable for typical handling and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6232ATCGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6232ATCGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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