Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;
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Other Function uPs,uCs & Peripheral ICs XCVE1752-2LLENSVG1369 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
JESD-30 Code:
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XCVE1752-2LLENSVG1369 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Fairchild Semiconductor
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
MC7805CTG
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sensitron Semiconductor
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BGM13S32F512GA-V3R
Silicon Labs
SoC;
MTFC4GMDEA-4MIT/TR
Micron Technology
MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER;
AX8052F143-3-TX40
AX8052F143-3-TX40 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V, suitable for industrial applications. It operates b/w -40 to 85°C, featuring CMOS technology and no-lead terminal form. Ideal for System on Chip designs, it has a compact rectangular package style with very thin profile and heat sink.
XC7Z030-1FFG676I
Xilinx
The Xilinx XC7Z030-1FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XTDA4VHXXXGAALY
XTDA4VHXXXGAALY by Texas Instruments is a 1414-terminal SoC IC with CMOS technology. It operates b/w 0-70°C, with supply voltage ranging from 0.76-0.84 V. This square-shaped IC in grid array package is ideal for applications requiring fine pitch and heat dissipation.
MIMX8MN1CVTIZAA
SYSTEM ON CHIP; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MSP430F6779IPEUR
MSP430F6779IPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. Ideal for industrial applications, it features 32KB RAM, 524288 ROM words, and supports I2C, SPI, UART bus compatibility.
MCP25050-E/SL
Microchip Technology
MCP25050-E/SL by Microchip: 8-bit microprocessor circuit with 5V supply, operating from -40 to 125 °C. Automotive grade, TS16949 screened IC in small outline package for surface mount applications. Features dual terminal position, CMOS technology, and matte tin finish on gull wing terminals.
HS103
Nel Frequency Controls
Other uPs/uCs/Peripheral ICs;
ATMXT224S-MAUR
Microchip Technology's ATMXT224S-MAUR is a 56-terminal, CMOS technology capacitive touch screen controller with a supply voltage range of 1.71V to 3.47V. Operating b/w -40°C to 85°C, it is ideal for applications requiring precise touch input control in compact spaces due to its square shape and low seated height of 0.6mm.
AR1100-I/MQ
Microchip Technology's AR1100-I/MQ is a CMOS microprocessor circuit with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C with supply voltage range of 3.135V to 3.465V, suitable for industrial applications requiring very thin profile and surface mount capability.
SLB9665XQ20FW563XUMA2
Infineon Technologies
Infineon's SLB9665XQ20FW563XUMA2 is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for applications requiring secure authentication in compact spaces due to its very thin profile and square shape package design.
NT3H2211W0FTTJ
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;
RN2903A-I/RMSA103
Microchip Technology's RN2903A-I/RMSA103 is a CMOS microprocessor circuit with 47 terminals and a rectangular package style. It operates b/w -40 to 85 °C, with a supply voltage range of 2.1V to 3.6V. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in surface-mount assemblies.
XA7Z020-1CLG400Q
XA7Z020-1CLG400Q by Xilinx is an automotive-grade microprocessor circuit with 400 terminals in a low-profile grid array package. Operating b/w -40 to 125°C, it features power supplies of 1V and 1.8V, making it ideal for automotive applications requiring high-performance computing capabilities.
5CSEBA6U19I7N
Intel
MCIMX283DVM4B
MCIMX283DVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35V to 1.55V. This low-profile, fine-pitch IC with 289 terminals is ideal for applications requiring high performance in compact spaces.
MCIMX6Y2CVM05AA
MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.
XC7Z030-1FFG676C
XC7Z030-1FFG676C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.
XC7Z014S-2CLG484I
XC7Z014S-2CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. This package, measuring 19mm x 19mm, features a grid array style and is ideal for various applications requiring low profile, fine pitch ICs.
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XCVE1752-1MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
XCVE2002-1LSESFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
XCVE2302-1MSISFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
XCVE1752-2HSINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
XCVE1752-1MSIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
XCVE1752-1LSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2197,47X47,36;
XCVE1752-1LLIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
XCVE1752-2HSIVSVA1596
XCVE1752-1LSEVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVE1752-1MLIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Width: 37.5 mm;
XCVE1752-1MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVE1752-1MSINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVE1752-1LSIVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
XCVE1752-1LSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVE1752-1MSENSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
XCVE1752-1LSENSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
XCVE1752-1MSEVSVA1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVE1752-1MLINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVE1752-1LLINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;
XCVE1752-1LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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